Degradation characteristics of blue GaN-LED chip related to packages

Physica Status Solidi (C) Current Topics in Solid State Physics

Volumn 7, Issue 7-8, 2010, Pages 2205-2207

  Kang, Jeung Mo ^a   Kim, Jae Wook ^b   Choi, Jeong Hyeon ^b   Kim, Du Hyun ^b   Oh, Pyung Sik ^a   Han, Sang Kook ^c   Kwon, Ho Ki ^b  

^a Korea Electric Testing Institute   (South Korea)

^b LG Innotek Co Ltd   (South Korea)

^c Yonsei University   (South Korea)

Author keywords

Design; GaN; LED

Indexed keywords

AGING TIME; BLUE LED CHIPS; CHIP SIZES; COMMERCIAL PACKAGES; CONTROL GROUPS; DEGRADATION CHARACTERISTICS; GAN; HIGH-POWER; LED; LED CHIPS; LOW POWER; METAL PACKAGES; PACKAGE MATERIALS;

DEGRADATION; GALLIUM ALLOYS; GALLIUM NITRIDE; LIGHT EMITTING DIODES; PHYSICAL OPTICS;

PACKAGING;

EID: 77955794012     PISSN: 18626351     EISSN: 16101642     Source Type: Journal    
DOI: 10.1002/pssc.200983512     Document Type: Conference Paper

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