Fabrication and thermal analysis of wafer-level light-emitting diode packages

IEEE Electron Device Letters

Volumn 29, Issue 10, 2008, Pages 1118-1120

  Kang, Jeung Mo ^a,b   Choi, Jeong Hyeon ^a,b   Kim, Du Hyun ^a,b   Kim, Jae Wook ^a,b   Song, Yong Seon ^a,b   Kim, Geun Ho ^a,b   Han, Sang Kook ^c  

^a LG Electronics Inc   (South Korea)

^b LG Innotek Co Ltd   (South Korea)

^c Yonsei University   (South Korea)

Author keywords

Junction temperature; Light emitting diodes (LEDs); Thermal resistance; Wafer level package

Indexed keywords

EID: 54749097879     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2008.2002749     Document Type: Article

References (6)

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