Dielectric breakdown of thinned BaO-Al2O3-B 2O3-SiO2 glass

Journal of the American Ceramic Society

Volumn 93, Issue 8, 2010, Pages 2346-2351

  Lee, Hoikwan ^a   Smith, Nicholas J ^a   Pantano, Carlo G ^a   Furman, Eugene ^a   Lanagan, Michael T ^a  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ETCHING; DIELECTRIC BREAKDOWN STRENGTH; DIELECTRIC BREAKDOWNS; DIELECTRIC LAYER; DIELECTRIC STRENGTHS; ELECTROSTATIC ENERGIES; ETCHING SOLUTIONS; GLASS THICKNESS; GOLD ELECTRODES; HIGH ELECTRIC FIELDS; LATENT HEAT OF VAPORIZATION; POWER-LAW DEPENDENCES; SELF-HEALING; WEIBULL MODULUS;

ALKALINITY; ELECTRIC BREAKDOWN; ELECTRIC FIELDS; ELECTROCHEMICAL ELECTRODES; ETCHING; METAL ANALYSIS; SILICON COMPOUNDS; SURFACE PROPERTIES; SURFACE ROUGHNESS; WEIBULL DISTRIBUTION;

GLASS;

EID: 77955721593     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2010.03749.x     Document Type: Article

References (26)

1. N. J. Smith, B. Rangarajan, M. T. Lanagan C. G. Pantano Alkali-Free Glass as A High Energy Density Dielectric Material Mater. Lett., 63 [15] 1245 1248 (2009).
2. J. Vermeer The Impulse Breakdown Strength of Pyrex Glass Physica, 20 [1-6] 313 316 (1954).
3. A. V. Hippel R. J. Maurer Electric Breakdown of Glasses and Crystals as a Function of Temperature Phys. Rev., 59 [10] 820 823 (1941).
4. J. J. O'Dwyer, The theory of electrical conduction and breakdown in solid dielectrics. Oxford University Press, Oxford, 1973.
5. L. A. Dissado J. C. Fothergill, Electrical Degradation and Breakdown in Polymers, Vol. 63. Peter Peregrinus Ltd. for IEE, United Kingdom, 1992.
6. F. Forlani N. Minnaja Electric Breakdown in Thin Dielectric Films J. Vac. Sci. Technol., 6 [4] 518 526 (1969).
7. R. Gerson T. C. Marshall Dielectric Breakdown of Porous Ceramics J. Appl. Phys., 30 [11] 1650 1653 (1959).
8. E. Furman, G. Sethi, B. Koch M. T. Lanagan Monte Carlo Modeling of Heterogeneities in Ceramic, Polymer, and Composite Capacitors 17th Annual IEEE Pulsed Power Conference, Washington DC, June 28-July 2, 2009.
9. N. Klein, Advances in Electronics and Electron Physics, Vol. 26, pp. 309 424. Academic Press, New York, 1969.
10. J. H. Tortai, N. Bonifaci, A. Denat C. Trassy Diagnostic of the Self-Healing of Metallized Polypropylene Film by Modeling of the Broadening Emission Lines of Aluminum Emitted by Plasma Discharge J. Appl. Phys., 97 [5] 053304, 9pp (2005).
11. E. Thiénot, F. Domingo, E. Cambril C. Grosse Reactive Ion Etching of Glass for Biochip Applications: Composition Effects and Surface Damages Microelectron. Eng., 83 [4-9] 1155 1158 (2006).
12. S. T. Tso J. A. Pask Reaction of Glasses with Hydrofluoric Acid Solution J. Am. Ceram. Soc., 65 [7] 360 362 (1982).
13. H. Zhu, M. Holl, T. Ray, S. Bhushan D. R. Meldrum Characterization of Deep Wet Etching of Fused Silica Glass for Single Cell and Optical Sensor Deposition J. Micromech. Microeng., 19, 065013, 8pp (2009).
14. H. K. Jang, Y. D. Chung, S. W. Whangbo, Y. S. Lee, I. W. Lyo, C. N. Whang, S. J. Lee G. Kim Effects of Chemical Etching with Sulfuric Acid on Glass Surface J. Vac. Sci. Technol. A, 18 [2] 401 404 (2000).
15. K. H. Oh, C. K. Ong B. T. G. Tan Variation of Trapping/Detrapping Properties as a Function of the Insulator Size J. Appl. Phys., 74 [3] 1960 1967 (1993).
16. H. Jhou, F. G. Shi B. Zhao Thickness Dependent Dielectric Breakdown of PECVD Low-k Carbon Doped Silicon Dioxide Dielectric Thin Films: Modeling and Experiments Microelectron. J, 34 [4] 259 264 (2003).
17. H. K. Kim F. G. Shi Thickness Dependent Dielectric Strength of a Low-Permittivity Dielectric Film IEEE Trans. Dielectr. Electr. Insulat., 8 [2] 248 252 (2001).
18. A. D. Milliken, A. J. Bell J. F. Scott Dependence of Breakdown Field on Dielectric (Interelectrode) Thickness in Base-Metal Electrode Multilayer Capacitors Appl. Phys. Lett., 90 [11] 112910, 3pp (2007).
19. C. H. Huang V. K. Agarwal Thickness Dependence of a Direct Current Breakdown Filed in Stearic Acid Films J. Vac. Sci. Technol. A, 3 [5] 2000 2003 (1985).
20. H. K. Lee, C. G. Pantano, M. T. Lanagan E. Furman Space Charge Limited Current in Thin Alkali-Free Glass J. Appl. Phys., in press.
21. D. L. Decker H. B. Vanfleet Melting and High-Temperature Electrical Resistance of Gold under Pressure Phys. Rev., 138 [1A] A129 33 (1965).
22. The Resistivity of Gold (Physics Fact Book). Available at (accessed April 5, 2010).
23. Application Information: Schott AF45, SCHOTT North America Inc., Available at (accessed April 5, 2010).
24. D. B. Chang, J. E. Drummond R. B. Hall High-Power Laser Radiation Interaction with Quartz J. Appl. Phys., 41 [12] 4851 4855 (1970).
25. Y. G. Basov S. A. Boldyrev Heat Losses in Xenon Flash Lamp with Short Discharge Time J. Appl. Spectrosc., 39 [4] 1252 1256 (1979).
26. B. Walgenwitz, J. H. Tortai, N. Bonifaci A. Denat Self-Healing of Metallized Polymer Films of Different Nature 2004 International Conference on Solid Dielectrics, Toulouse, France, 29-32, 2004.