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Applied Physics Letters

Volumn 97, Issue 4, 2010, Pages

Mechanical and thermal stability of plasmonic emitters on flexible polyimide substrates

(6) Araci, Ismail Emre a Demir, Veysi a Kropachev, Aleksandr b Skotheim, Terje b Norwood, Robert A a Peyghambarian, N a

a UNIVERSITY OF ARIZONA (United States)

b Intex (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION; EFFECTS OF TEMPERATURE; FAST SWITCHING; FLEXIBLE POLYIMIDE; FLEXIBLE POLYIMIDE SUBSTRATE; HEAT CONDUCTIVITY; HEXAGONAL LATTICE; HIGH TEMPERATURE RESISTANCE; IR EMITTERS; LOW-POWER CONSUMPTION; MECHANICAL STRAIN; PI FILM; PLASMONIC; THERMAL INFRARED; THERMAL MASS; THERMAL STABILITY;

MECHANICAL PROPERTIES; PLASMONS; POLYIMIDES; SILVER; TEMPERATURE; THERMODYNAMIC STABILITY;

THERMAL EXPANSION;

EID: 77955720855 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.3462795 Document Type: Article

Times cited : (3)

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