Mechanical failure analysis of thin film transistor devices on steel and polyimide substrates for flexible display applications

Engineering Fracture Mechanics

Volumn 77, Issue 4, 2010, Pages 660-670

  Leterrier, Y ^a   Pinyol, A ^a   Gillieron D ^a   Månson, J A E ^a   Timmermans, P H M ^b   Bouten, P C P ^b   Templier, F ^c  

^a LABORATOIRE DE TECHNOLOGIE DES COMPOSITES ET POLYMÈRES LTC   (Switzerland)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c CEA LETI   (France)

Author keywords

Crack initiation; Electronics; Polyimide substrate; Steel substrate; Thin film transistor

Indexed keywords

4-LEVEL; BACKPLANE DESIGN; CRITICAL STRAINS; ELASTIC CONTRAST; ELECTRONICS; IN-SITU; INSULATOR LAYER; INTERNAL STRESS; LOADING DIRECTION; MECHANICAL FAILURE ANALYSIS; OPTICAL MICROSCOPES; POLYIMIDE SUBSTRATE; STEEL FOILS; TENSILE FAILURES;

CRACK INITIATION; CRACKS; FAILURE ANALYSIS; FLEXIBLE DISPLAYS; POLYIMIDES; QUALITY ASSURANCE; SAFETY FACTOR; SILICON COMPOUNDS; STRESS CORROSION CRACKING; STRESSES; THIN FILM TRANSISTORS; THIN FILMS;

SUBSTRATES;

EID: 76049090616     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.engfracmech.2009.12.016     Document Type: Article

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