Microstructure and thermal conductivity of submicron Si3N 4 reinforced 2024Al composite

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 19, Issue SUPPL. 2, 2009, Pages

  Yang, Wen Shu ^a   Xiu, Zi Yang ^a   Chen, Guo Qin ^a   Wu, Gao Hui ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Calculation; Composite; Interface; Submicron particles; Thermal conductivity

Indexed keywords

AL COMPOSITES; AL MATRIX COMPOSITES; ANNEALING TREATMENTS; AS-CAST; CASTING DEFECT; COMPOSITE; FLAT SURFACES; H-S MODELS; INTERFACE; MATRIX; MAXWELL MODELS; PARTICLE CLUSTERING; PRESSURE INFILTRATION; ROOM TEMPERATURE; SERRATED SURFACES; SUB-MICRON PARTICLES; SUBMICRON; THERMO-CONDUCTIVITY;

ALUMINUM; MICROSTRUCTURE; PRESSURE EFFECTS; THERMAL CONDUCTIVITY; THERMOANALYSIS;

SILICON;

EID: 77955678318     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(10)60073-8     Document Type: Article

References (16)

1. IS HAN, DW SEO, SY KIM, KS HONG, KH GUAHK, KS LEE Properties of silicon nitride for aluminum melts prepared by nitrided pressureless sintering [J] Journal of the European Ceramic Society 28 2008 1057 1063
2. H HUANG, KJ WINCHESTER, A SUVOROVA, BR LAWN, Y LIU, XZ HU Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films [J] Mater Sci Engineering A 435/436 2006 453 459
3. E CARRASQUERO, A BELLOSI, MH STAIA Characterization and wear behavior of modified silicon nitride [J] International Journal of Refractory Metals and Hard Materials 23 4/6 2005 391 397
4. 4/Al composite [J] Rare Metal Materials and Engineering 36 s1 2007 777 780
5. 4 infiltration technique [J] Mining and Processing Equipment 35 8 2007 122 124
6. 4/Al composite prepared by pressureless infiltration [J] Journal of Aeronautical Materials 26 1 2006 55 58 (in Chinese)
7. 4/Si substrates [J] Mater Sci and Eng A 491 1/2 2008 461 469
8. Guo-hui WU, Qiang ZHANG, Guo-qin CHEN, Long-tao JIANG, Zi-yong XIU Properties of high reinforcement-content aluminum matrix composite for electronic packages [J] Journal of Materials Science Materials in Electronics 14 1 2003 9 12
9. 3 particulates [J] Scripta Materialia 36 8 1997 883 889
10. Q ZHANG, ZY XIU, MH SONG, GH WU Microstructure and properties of a 70vol SiCp/Al-12Si composite for electronic packaging [J] Materials Science Forum 475/479 2005 881 884
11. 3 particles by rare-earth on interfacial wettability of Al matrix composites [J] The Chinese Journal of Nonferrous Metals 15 7 2005 1087 1093 (in Chinese)
12. 3p/1070Al composites [J] The Chinese Journal of Nonferrous Metals 12 2 2002 342 347 (in Chinese)
13. 4/Al-Mg composites fabricated by pressureless infiltration [J] Journal of Materials Science 42 2007 7812 7818
14. JD ESHELBY The determination of the elastic field of an ellipsoidal inclusion, and related problems [J]. Proceedings of the Royal Society of London Series A, Mathematical and Physical Sciences 1957 The Royal Society London 376 396
15. H HATTA, M TAYA Effective thermal conductivity of a misoriented short fiber composite [J] Journal of Applied Physics 58 7 1985 2478 2486
16. PG KLEMENS The thermal conductivity of dielectric solids at low temperatures (theoretical) [J] Proceedings of the Royal Society of London Series A, Mathematical and Physical Sciences 1951 108 133