Properties of high reinforcement-content aluminum matrix composite for electronic packages

Journal of Materials Science: Materials in Electronics

Volumn 14, Issue 1, 2003, Pages 9-12

  Wu, Gaohui ^a   Zhang, Qiang ^a   Chen, Guoqin ^a   Jiang, Longtao ^a   Xiu, Ziyang ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COST EFFECTIVENESS; ELECTRIC DISCHARGE MACHINING; ELECTRONICS PACKAGING; MICROSTRUCTURE; REINFORCEMENT; SUBSTRATES; THERMAL CONDUCTIVITY; THERMAL EXPANSION; VOLUME FRACTION;

ALUMINUM MATRIX COMPOSITES;

METALLIC MATRIX COMPOSITES;

EID: 0037284108     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1021567329773     Document Type: Article

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