Reactive wetting and spreading of Al-Si-Mg alloys on Si3N4/Si substrates

Materials Science and Engineering: A

Volumn 491, Issue 1-2, 2008, Pages 461-469

  de la Pena J L ^a   Pech Canul, M I ^a  

^a DEPARTAMENTO DE FÍSICA   (Mexico)

Author keywords

Al Si Mg alloys; Contact angle; Reactive wetting; Si3N4 Si substrates; Surface tension

Indexed keywords

ALUMINUM ALLOYS; ARGON; CHEMICAL BONDS; MAGNESIA; MAGNESIUM ALLOYS; NITROGEN; NITROGEN COMPOUNDS; PHASE INTERFACES; SILICON ALLOYS; SURFACE REACTIONS; SURFACE TENSION; WETTING;

CHEMICAL INTERACTIONS; DROPLET SURFACES; OPTIMIZED CONDITIONS; PROCESSING PARAMETERS; REACTIVE WETTING; SESSILE DROP TECHNIQUES; SI SUBSTRATES; SI3N4/SI SUBSTRATE; WETTING AND SPREADING; WETTING BEHAVIOR;

CONTACT ANGLE;

ALLOY; ALUMINUM; ARGON; CHEMICAL REACTIONS; CONTACT ANGLE; DROPS; IMPURITIES; MAGNESIUM; NITROGEN; PRINTING PLATES; SILICON; SUBSTRATES; SURFACE TENSION; TERNARY SYSTEMS; WETTING;

EID: 46249116733     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2008.02.025     Document Type: Article

References (32)

1. Laurent V., Chatain D., and Eustathopoulos N. Mater. Sci. Eng. A A135 (1991) 89-94
2. Kritalis P., Drevet B., and Eustathopoulos N. Scripta Metall. Mater. 30 9 (1994) 1127-1132
3. Espie L., Drevet B., and Eustathopoulos N. Metall. Trans. A 25A (1994) 599-605
4. Naidich Y.V., Zhuravlev V., and Krasovskaya N. Mater. Sci. Eng. A A245 (1998) 293-299
5. Levi G., Bmaberger M., and Kaplan W.D. Acta Mater. 47 14 (1999) 3927-3934
6. Shen P., Fujii H., Matsumoto T., and Nogi K. Metall. Trans. A 35A (2004) 583-588
7. Delannay F., Froyen L., and Deruyttere A. J. Mater. Sci. 22 (1987) 1-16
8. Chen J., and Gu M. J. Mater. Res. 17 4 (2002) 911-917
9. Aksay I.A., Hoge C.E., and Pask J.A. J. Phys. Chem. 78 12 (1974) 1178-1183
10. Saiz E., Cannon R.M., and Tomsia P. Acta Mater. 48 (2000) 4449-4462
11. Voué M., and De Conink J. Acta Mater. 48 (2000) 4405-4417
12. Adamson A.W. Physical Chemistry of Surfaces. 1st ed. (1960), Interscience Publishers, New York, NY
13. Yost F.G., and Domig Jr. A.D. MRS Proc. 108 (1998) 385-390
14. Hou Q., Mutharasan R., and Koczak M. J. Mater Sci. Eng. A A195 (1995) 121-129
15. Rodríguez-Reyes M., Pech-Canul M.I., Parras-Medécigo E.E., and Gorokhovsky A. Mater. Lett. 57 (2003) 2081-2089
16. Srinivasa Rao B., and Jayaram V. Acta Mater. 49 (2001) 2373-2385
17. Levi G., Bamberger M., and Kaplan W.D. Acta Mater. 47 (1999) 3927-3934
18. Lee K.B., and Kwon H. Metall. Mater. Trans. A 30A (1999) 2999-3007
19. Wang S.R., Geng H.R., and Wang Y.Z. Mater. Sci. Technol. 22 2 (2006) 223-226
20. Wang S.-R., Wang Y.-Z., Wang Y., Geng H.-R., and Chi Q. J. Mater. Sci. 42 (2007) 7812-7818
21. Klein R., Desmaison-Brut M., Ginet P., Bellosi A., and Desmaison J. J. Eur. Ceram. Soc. 25 (2005) 1757-1763
22. Eustathopoulos N., Nicholas M.G., and Brevet B. In: Cahn R.W. (Ed). Wettability at High Temperatures (1999), Pergamon, New York pp. 294-295
23. Loehman R.E., Tomsia A.P., and Pask J.A. J. Am. Ceram. Soc. 73 3 (1990) 552-558
24. Pech-Canul M.I., Katz R.N., and Makhlouf M.M. Metall. Mater. Trans. A 31A (2000) 565-573
25. Roy R.K. A Primer on the Taguchi Method, Society of Manufacturing Engineers (1990), Dearborn, MI
26. Pech-Canul M.I., de la Peña J.L., and Leal-Cruz A.L. J. Appl. Phys. A 89 (2007) 729-735
27. Murr L.E. Interfacial Phenomena in Metals and Alloys. 1st ed. (1975), Addison-Wesley Publishing Co., Reading, MA
28. M.K. Aghajanian, et al., US Patent 5,298,339 (1994).
29. Lee W.E., and Rainforth W.M. Ceramic Microstructures Property Control by Processing (1994), Chapman & Hall, New York, NY
30. Riley F.L. J. Am. Ceram. Soc. 83 2 (2000) 245-265
31. Pi X.D., Magnolini L., Campbell S.A., and Kortshagen S.A. Phys. Rev. B 75 (2007) 085423-1-082453-5
32. Ueda M., Beloto A.F., Reuther H., and Parascandola S. Surf. Coat. Technol. 136 (2001) 244-248