Hygro-thermo-mechanical reliability assessment of a thermal interface material for a ball grid array package assembly

Journal of Electronic Packaging

Volumn 132, Issue 2, 2010, Pages 0210041-0210048

  Liu, Xi ^a   Zheng, Jiantao ^b   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b IBM   (United States)

Author keywords

Debonding; Hygro thermo mechanical model; Reliability; Thermal interface material

Indexed keywords

BALL GRID ARRAYS; DEBONDING; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; IMAGE CORRELATION; MICROELECTRONICS; MOISTURE;

%MOISTURE; BALL GRID ARRAY PACKAGES; HYGRO-THERMO-MECHANICAL MODELING; MOISTURE EFFECTS; OVERALL EFFECTIVENESS; POLYMER MATERIALS; RELIABILITY ASSESSMENTS; THERMAL; THERMAL INTERFACE MATERIALS; THERMOMECHANICAL RELIABILITY;

DELAMINATION;

EID: 77955545892     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4001746     Document Type: Article

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