Enhancing heat capacity of colloidal suspension using nanoscale encapsulated phase-change materials for heat transfer

ACS Applied Materials and Interfaces

Volumn 2, Issue 6, 2010, Pages 1685-1691

  Hong, Yan ^a,b   Ding, Shujiang ^a   Wu, Wei ^d   Hu, Jianjun ^c   Voevodin, Andrey A ^c   Gschwender, Lois ^c   Snyder, Ed ^c   Chow, Louis ^b   Su, Ming ^a,b  

^a UNIVERSITY OF CENTRAL FLORIDA   (United States)

^b University of Central Florida   (United States)

^c AIR FORCE RESEARCH LABORATORY   (United States)

^d NONE

Author keywords

colloid suspension; encapsulation; heat transfer; phase change nanoparticles

Indexed keywords

COLLOID SUSPENSION; COLLOID SUSPENSIONS; COLLOIDAL SUSPENSIONS; HEAT CAPACITIES; HEAT-GENERATING DEVICES; INDIUM NANOPARTICLES; LOW-TEMPERATURE APPLICATIONS; MOLTEN PHASE; NANO SCALE; PHASE CHANGES; SINGLE-PHASE FLUID; SINGLE-PHASE LIQUIDS; SOLID LIQUID PHASE CHANGE;

AGGLOMERATION; COLLOID CHEMISTRY; DIELECTRIC MATERIALS; DIELECTRIC PROPERTIES; HEAT EXCHANGERS; HEAT TRANSFER; INDIUM; MOLTEN MATERIALS; NANOPARTICLES; OLEFINS; PARAFFIN WAXES; PARAFFINS; SILICA; SUSPENSIONS (FLUIDS);

PHASE CHANGE MATERIALS;

INDIUM; METAL NANOPARTICLE; NANOMATERIAL; NANOPARTICLE; PARAFFIN; POLYMER; SILICON DIOXIDE;

ARTICLE; CHEMISTRY; COLLOID; EQUIPMENT DESIGN; HEAT; MATERIALS TESTING; METHODOLOGY; NANOTECHNOLOGY; TEMPERATURE;

COLLOIDS; EQUIPMENT DESIGN; HOT TEMPERATURE; INDIUM; MATERIALS TESTING; METAL NANOPARTICLES; NANOPARTICLES; NANOSTRUCTURES; NANOTECHNOLOGY; PARAFFIN; POLYMERS; SILICON DIOXIDE; TEMPERATURE;

EID: 77955505441     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am100204b     Document Type: Article

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