Micro-channel thermal management of high power devices

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 2006, Issue , 2006, Pages 885-891

  Solovitz, Stephen A ^a   Stevanovic, Ljubisa D ^a   Beaupre, Richard A ^a  

^a GE GLOBAL RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE METAL BRAZE (AMB); INFRARED THERMOGRAPHY; MICROCHANNELS; POWER DIODES;

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; HEAT FLUX; HEAT SINKS; SEMICONDUCTOR DEVICES; SEMICONDUCTOR JUNCTIONS; SILICON; THERMAL CONDUCTIVITY; THERMOGRAPHY (IMAGING);

POWER ELECTRONICS;

EID: 33749511114     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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2. D.B. Tuckerman and R.F.W. Pease, "High-performance heat sinking for VLSI," IEEE Electron. Device Letters, vol. 2, pp. 126-129, 1981.
3. R.W. Knight, D.J. Hall, J.S. Goodling, and R.C. Jaeger, "Heat Sink Optimization with Application to Microchannels," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, no. 5, pp. 832-842, October 1992.
4. R.K. Shah and A.L. London, "Laminar flow forced convection in ducts," Advances in Heat Transfer, Supplement 1, Academic Press, 1978.
5. S.V. Garimella, S. V. and C.B. Sobhan, "Transport in Microchannels A Critical Review," Annual Reviews of Heat Transfer, vol. 13, pp. 1-50, 2003.
6. S. Kakaç, R.K. Shah, and W. Aung, Handbook of Single-phase Convective Heat Transfer, New York: John Wiley & Sons, pp. 68 - 70, 1987.