On the conduction and convection heat transfer from lightweight advanced heat sinks

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 2, 2010, Pages 424-431

  Dogruoz, M Baris ^a   Arik, M ^b  

^a ANSYS INC   (United States)

^b GE GLOBAL RESEARCH   (United States)

Author keywords

Advanced materials; Anisotropic orthotropic thermal conductivity; Electronics cooling; Natural convection

Indexed keywords

ACTIVE COOLING; ADVANCED MATERIALS; AIR COOLING; CONVECTION HEAT TRANSFER; CONVECTION RESISTANCE; ELECTRONICS COOLING; ENGINEERING MATERIALS; FIGURE OF MERIT; FOAM HEAT SINKS; HEAT SINK MATERIALS; HIGH HEAT FLUX; LOW DENSITY; LOW FLUX; NATURAL CONVECTION HEAT TRANSFER; NUMERICAL SIMULATION; PYROLYTIC GRAPHITE; REAL ESTATE; THERMAL PERFORMANCE; THERMAL RESISTANCE; THERMO-PHYSICAL PROPERTY; TOTAL RESISTANCE;

ANISOTROPY; COMPUTER SIMULATION; COOLING; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; FOAMS; HEAT CONDUCTION; HEAT SINKS; MATERIALS; MIXED CONVECTION; NATURAL CONVECTION; THERMAL CONDUCTIVITY; THERMOANALYSIS;

HEAT RESISTANCE;

EID: 77953478904     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2039794     Document Type: Article

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