Capability of inkjet technology in electronics manufacturing

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1330-1336

  Mäntysalo, Matti ^a   Pekkanen, Ville ^a   Kaija, Kimmo ^a   Niittynen, Juha ^a   Koskinen, Santtu ^a   Halonen, Eerik ^a   Mansikkamäki, Pauliina ^b   Hämeenoja, Ossi ^c  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b Nokia DSN Technology Services

^c Nokia CS Six Sigma

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVE MANUFACTURING; CAPABILITY ANALYSIS; DOT MATRIX; ELECTRONICS MANUFACTURING; HIGH PERFORMANCE PRODUCTS; IMPROVED PROCESS; INK JET TECHNOLOGY; INKJET PRINTING TECHNOLOGY; MASS PRODUCTION; POLYIMIDE SUBSTRATE; PRINTABLE ELECTRONICS; PROCESS IMPROVEMENT; RADIOFREQUENCY IDENTIFICATION TAGS; ROAD-MAPS; SIX-SIGMA METHODOLOGY; SYSTEMATIC PROGRAM; TECHNICAL DEVELOPMENT; TECHNOLOGY DEVELOPMENT;

MATHEMATICAL MODELS; POLYIMIDES; PRINTING; PRODUCTION ENGINEERING; SUBSTRATES; TECHNOLOGICAL FORECASTING; WORK SIMPLIFICATION;

TECHNOLOGY;

EID: 70349658236     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074185     Document Type: Conference Paper

References (10)

1. Kaija K., Pekkanen V., Mäntysalo M., and Mansikkamäki P., "Applicability of Inkjet Technology for Electronics Manufacturing", Proc. of SMTA International, Orlando, Florida, August 17-21, 2008.
2. Gasman L., "A Roadmap for Printable Electronics", IMI's 4th Annual Printable Electronics and Displays Conference & Trade Fair, Las Vegas, USA, 2005.
3. Mäntysalo M. and Mansikkamäki P., "Next Generation Hardware Integration", (invited), Proc. of European Coating Conf. The Power of Ink-jet Materials V, Dec. 6th- 7th, 2007, Berlin, Germany, pp. 117-125.
4. Saito, H., Matsuba, Y., "Liquid Wiring Technology by Inkjet Printing Using Nanopaste", Proc. of 39th International Symposium on Microelectronics, San Diego, USA, 2006.
5. Molesa S. E., de la Fuente Vornbrock A., Chang P.C., and Subramanian V., "Low-Voltage Inkjetted Organic Transistors for Printed RFID and Display Applications", IEEE International Electron Device Meeting, 2005.
6. Pekkanen, V., Mäntysalo, M., Mansikkamäki, P. "Design Considerations for Inkjet Printed Electronic Interconnections and Packaging" 40th International Symposium on Microelectronics, November 11-15, 2007, San Jose, California, pp.1076-1083.
7. Mäntysalo, M., Mansikkamäki, P., "Inkjet Deposited Interconnections for Electronic Packaging", Proceedings of IST Digital Fabrication, Alaska, USA, Sept. 16th-21st, 2007, pp. 813 817.
8. Murata K., "Super-fine Ink-jet Printing for Nanotechnology", International Conference on MEMS, Nano, and Smart Systems, July 20th-23rd, 2003, pp. 346- 349.
9. Miettinen J., Pekkanen V., Kaija K., Mansikkamäki P., Mäntysalo J., Mäntysalo M., Niittynen J., Pekkanen J., Saviauk T., Rönkkä, R., "Inkjet printed System-in- Package design and manufacturing", ELSEVIER Microelectronics Journal, Article in Press.
10. Mäntysalo, M., Mansikkamäki, P., Miettinen, J., Kaija, K., Pienimaa, S., Rönkkä, R., Hashizume, K., Kamigori, A., Matsuba, Y., Oyama, K., Terada, N., Saito, H., Kuchiki, M., Tsubouchi, M., "Evaluation of Inkjet Technology for Electronic Packaging and System Integration", Proc. of 57th Electronic Components and Technology Conference, Reno, Nevada, USA, 2007.