Server rack rear door heat exchanger and the new ASHRAE recommended environmental guidelines

Proceedings of the ASME InterPack Conference 2009, IPACK2009

Volumn 2, Issue , 2010, Pages 851-862

  Schmidt, Roger ^a   Iyengar, Madhusudan ^a  

^a NONE

Author keywords

Coolblue; Heat exchanger; IT rack; Rear door; Water cooled

Indexed keywords

COOLBLUE; DATA CENTERS; ENVIRONMENTAL GUIDELINES; ENVIRONMENTAL TEMPERATURE; HOT SPOT; IT EQUIPMENT; IT RACK;

DOORS; ENERGY EFFICIENCY; HEAT EXCHANGERS; SATELLITE COMMUNICATION SYSTEMS;

FAILURE ANALYSIS;

EID: 77953921397     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/InterPACK2009-89212     Document Type: Conference Paper

References (7)

1. U.S. IBM Patent 7,385,810, "Apparatus and Method for Facilitating Cooling of an Electronics Rack Employing a Heat Exchange Assembly Mounted to an Outlet Door Cover of the Electronics Rack
2. ASHRAE, "Thermal Guidelines for Data Processing Equipment - second edition", 2009, available from http://tc99.ashraecs.org/
3. Schmidt, R., "Effect of Data Center Characteristics on Data Processing Equipment Inlet Temperatures", Advances in Electronic Packaging 2001(Proceedings of IPACK '01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition), Vol. 2, Paper IPACK2001-15870, Kauai, Hawaii, July 8-13, 2001, pp. 1097-1106.
4. Tileflow, Innovative Research, Inc.
5. Schmidt, R. R. and Iyengar, M., "Effect of Data Center Layout on Rack Inlet Air Temperatures", Proceedings of the Pacific Rim/ASME International Electronic Packaging Technical Conference, INTERpack '05,San Francisco, California, July 17-22, 2005.
6. Schmidt, R.R. and Thermal Profile of a High Density Data Center - Methodology to Thermally Characterize a Data Center", ASHRAE Symposium, Nashville, TN, June, 2004, 8 pages.
7. Schmidt, R.R. and Iyengar, M. , "Thermal Profile of a High Density Data Center", ASHRAE Summer Annual Meeting, Denver, June 19-25, 2005.