Refrigeration heat exchanger systems for server rack cooling in data centers

Proceedings of the ASME InterPack Conference 2009, IPACK2009

Volumn 2, Issue , 2010, Pages 915-921

  Tsukamoto, Takeshi ^a   Takayoshi, Jyunji ^a   Schmidt, Roger R ^b   Iyengar, Madhusudan K ^b  

^a IBM JAPAN LTD   (Japan)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLANT LOOPS; COOLING ENERGY; DATA CENTER COOLING; DATA CENTERS; ELECTRONIC RACKS; ENERGY SAVING; EXPERIMENTAL DATA; EXPERIMENTAL MEASUREMENTS; SUBSTANTIAL ENERGY; TEST DATA; THERMAL DATA; VAPOR-COMPRESSION SYSTEMS;

COOLING; COOLING SYSTEMS; ENERGY CONSERVATION; ENERGY EFFICIENCY; HEAT EXCHANGERS; REFRIGERANTS; WATER VAPOR;

SATELLITE COMMUNICATION SYSTEMS;

EID: 77953942694     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/InterPACK2009-89258     Document Type: Conference Paper

References (1)

1. R. Schmidt, R. Chu, M. Ellsworth, M. Iyengar, D. Porter, V. Kamath, and B. Lehman, "Maintaining Datacom Rack Inlet Air Temperatures with Water Cooled Heat Exchanger," Proceedings of IPACK2005, ASME InterPACK'05, San Francisco, CA, July 2005.