High-accuracy thermal analysis methodology for semiconductor junction temperatures by considering line patterns of three-dimensional modules

Journal of Electronic Packaging

Volumn 131, Issue 2, 2009, Pages 0210071-0210076

  Kumano, Yutaka ^a   Ogura, Tetsuyoshi ^a   Yamada, Toru ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

3D module; CAD; CFD; Junction temperature; Pattern; PCB; Semiconductor; Trace

Indexed keywords

ANISOTROPY; COMPUTATIONAL FLUID DYNAMICS; COMPUTER AIDED DESIGN; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR JUNCTIONS; THERMOANALYSIS;

3D MODULE; ANALYTICAL RESULTS; FLUID DYNAMIC ANALYSIS; FLUID-DYNAMIC ANALYSIS; HIGH-ACCURACY; JUNCTION TEMPERATURES; LINE PATTERN; MULTIPLE REGIONS; PATTERN; TRACE;

JUNCTION TEMPERATURE;

EID: 77955198536     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.3103947     Document Type: Article

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