Component size and effective thermal conductivity of printed circuit boards

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 489-494

  Shabany, Younes ^a  

^a Applied Thermal Technologies   (United States)

Author keywords

Compact Model; Printed Circuit Board; Thermal Conductivity; Thermal Modeling

Indexed keywords

COMPUTER SIMULATION; HEAT CONVECTION; HEAT TRANSFER COEFFICIENTS; PRINTED CIRCUIT BOARDS; SURFACE MOUNT TECHNOLOGY;

THERMAL MODELING;

THERMAL CONDUCTIVITY;

EID: 0036457872     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. V.P. Manno, N.R. Kurita and K. Azar, "Experimental Characterization of Board Conduction Effects", Proceedings of the Ninth IEEE SEMI-THERM Symposium, February 1993, pp. 127 - 135.
2. H. Shaukatullah and M. Gaynes, "Experimental Determination of the Effect of Printed Circuit Card Conductivity on the Thermal Performance of Surface Mount Electronic Packages", Proceedings of the Tenth IEEE SEMI-THERM Symposium, February 1994, pp. 44 - 52.
3. Yunus A. Cengel, "Heat Transfer, A Practical Approach", McGraw-Hill, 1998.
4. K. Azar and J.E. Graebner, "Experimental Deterruination of Thermal Conductivity of Printed Wiring Boards", Proceedings of the Twelfth IEEE SEMITHERM Symposium, March 1996, pp. 169 - 182.
5. T.F. Lemczyk, B. Mack, J.R. Culham and M.M. Yovanovich, "PCB Trace Thermal Analysis and Effective Conductivity", Proceedings of the Seventh IEEE SEMI-THERM Symposium, February 1991, pp. 15 - 22.
6. J. Lohan, P. Tiilikka, P. Rodgers, C.-M. Fager and J. Rantala, "Using Experimental Analysis to Evaluate the Influence of Printed Circuit Board Construction on the Thermal Performance of Four Package Types in both Natural and Forced Convection", Proceedings of the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2000), Vol. 2, May 2000, pp. 213 - 225.
7. J.R. Culham and M.M. Yovanovich, "Factors Affecting the Calculation of Effective Conductivity in Printed Circuit Boards", Proceedings of the Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm'98), May 1998, pp. 460 467.
8. "Icepak Version 3 User's Guide", Fluent. Inc., Lebanon, New Hampshire, 1999.