The effect of surface roughness on in-situ intrinsic tensile stress behavior in Cu thin films

Journal of Nanoscience and Nanotechnology

Volumn 10, Issue 5, 2010, Pages 3647-3649

  Cho, Moohyun ^a   Ryu, Sang ^a   Kim, Youngman ^a  

^a Chonnam National University   (South Korea)

Author keywords

Evaporation; In Situ intrinsic stress; Surface roughness; Thin film

Indexed keywords

A-THERMAL; CU THIN FILM; CURVATURE MEASUREMENT; EVAPORATION DEVICES; IN-SITU; IN-SITU TENSILE; INSITU STRESS; INTRINSIC STRESS; MULTI-BEAM; SI(111) SUBSTRATE; SUBSTRATE SURFACE; SURFACE AREA; VOLUME CONTRACTION;

COALESCENCE; COPPER; DEPOSITION; GRAIN GROWTH; METAL ANALYSIS; SURFACE PROPERTIES; SURFACE ROUGHNESS; TENSILE STRESS; THIN FILMS; VAPOR DEPOSITION;

THERMAL EVAPORATION;

EID: 77955004679     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2010.2301     Document Type: Conference Paper

References (11)

1. R. Abermann, R. Kramer, and J. Maser, Thin Solid Films 52, 215 (1978).
2. A. L. Shull and F. Spaepen, J. Appl. Phys. 80, 6243 (1996).
3. K. Kinosita, K. Maki, K. Nakamizo, and K. Takeuchi, Jpn. J. Appl. Phys. 6, 42 (1967).
4. R. Abermann, Vacuum 41, 1279 (1990).
5. R. Abermann, R. Koch, and R. Kramer, Thin Solid Films 58, 365 (1979).
6. M. Janda and O. Stefan, Thin Solid Films 112, 127 (1984).
7. P. Chaudhari, J. Vac. Sci. Technol. 9, 520 (1976).
8. D. W. Pashley, M. J. Stowell, and M. H. Jacobs, Phill. Mag. 10, 127 (1964).
9. R. W. Hoffman, Thin Solid Films 34, 185 (1976).
10. W. D. Nix and B. M. Clemens, J. Mater. Res. 14, 3467 (1999).
11. C. Friesen and C. V. Thompson, Phys. Rev. Lett. 89, 126103 (2002).