Thiol versus selenol SAMs as nucleation enhancers and adhesion promoters for plasma polymerized pyrrole on copper substrates

Plasma Processes and Polymers

Volumn 7, Issue 7, 2010, Pages 601-609

  Yagüe, José Luis ^a   Agulló, Núria ^a   Fonder, Gregory ^b   Delhalle, Joseph ^b   Mekhalif, Zineb ^b   Borrós, Salvador ^a  

^a INSTITUT QUÍMIC DE SARRIÀ   (Spain)

^b UNIVERSITY OF NAMUR   (Belgium)

Author keywords

Plasma enhanced chemical vapor deposition (pecvd); Plasma polymerized pyrrole; Selenol molecules; Self assembled monolayers (sams); Thiol molecules

Indexed keywords

ADHESION PROMOTER; AFM; COPPER SUBSTRATES; DEPOSITION PROCESS; ELECTROCHEMICAL TECHNIQUES; ELECTRONIC COMPONENT; MODIFIED SURFACES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD); PM-IRRAS; PPY FILMS; SAMS; THIOL MOLECULES; XPS;

ADHESION; COPPER; DEPOSITION; ELECTRON ENERGY LEVELS; MOLECULES; NITROGEN COMPOUNDS; PLASMA DEPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA POLYMERIZATION; PLASMAS; POLYMERS; POLYPYRROLES; SUBSTRATES; VAPOR DEPOSITION;

SELF ASSEMBLED MONOLAYERS;

EID: 77954902991     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.200900178     Document Type: Article

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