Electromechanical behavior of the curled cantilever beam

Journal of Micro/Nanolithography, MEMS, and MOEMS

Volumn 8, Issue 3, 2009, Pages

  Chuang, Wan Chun ^a   Hu, Yuh Chung ^b   Lee, Chi Yuan ^c   Shih, Wen Pin ^d   Chang, Pei Zen ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b NATIONAL ILAN UNIVERSITY   (Taiwan)

^c YUAN ZE UNIVERSITY   (Taiwan)

^d NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

MEMS; Microcantilever beam; Pull in voltage; Young's modulus

Indexed keywords

CANTILEVER BEAMS; COMPUTER SIMULATION; ELASTIC MODULI; ELASTICITY; ELECTRIC PROPERTIES; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; MODELS; PILE FOUNDATIONS; TESTING;

ANALYTICAL MODEL; APPROXIMATE ANALYTICAL SOLUTIONS; BEAM MODEL; ELECTRICAL TESTING; ELECTROMECHANICAL BEHAVIOR; FRINGING FIELDS; MATERIAL PROPERTY; MICROCANTILEVER BEAMS; MINIMUM ENERGY; NONIDEAL; PULL-IN VOLTAGE; STRESS GRADIENT; WAFER LEVEL; YOUNG'S MODULUS;

NANOCANTILEVERS;

EID: 77954793761     PISSN: 19325150     EISSN: 19325134     Source Type: Journal    
DOI: 10.1117/1.3158355     Document Type: Article

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