Novel automatic electrochemical-mechanical polishing (ECMP) of metals for scanning electron microscopy

Micron

Volumn 41, Issue 6, 2010, Pages 615-621

  Tiley, J ^a   Shiveley, K ^b   Viswanathan, G B ^b   Crouse, C A ^a   Shiveley, A ^c  

^a AIR FORCE RESEARCH LABORATORY   (United States)

^b WRIGHT PATTERSON AIR FORCE BASE   (United States)

^c UNIVERSAL TECHNOLOGY CORPORATION   (United States)

Author keywords

EBSD; Electro mechanical polishing; Electron microscopy imaging; Titanium polishing

Indexed keywords

ALKALINE ELECTROLYTES; AUTOMATED POLISHING; CYCLIC POTENTIAL; EBSD; ELECTRICAL POTENTIAL; ELECTRO-MECHANICAL; ELECTRO-MECHANICAL POLISHING; ELECTROCHEMICAL REACTIONS; ELECTRON BACK SCATTER DIFFRACTION; LOW STRESS; MECHANICAL POLISHING; MECHANICAL PROCESS; MECHANICAL VIBRATIONS; PASSIVATION LAYER; SUB-SURFACE DAMAGE; TI-6AL-4V; PULSED-ELECTROCHEMICAL;

ELECTRONS; NICKEL ALLOYS; PASSIVATION; SCANNING ELECTRON MICROSCOPY; TITANIUM; TITANIUM ALLOYS; VIBRATIONS (MECHANICAL);

POLISHING;

EID: 77954386082     PISSN: 09684328     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.micron.2010.03.008     Document Type: Article

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