Revisiting the thermal conductivity of nanoporous materials

Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009

Volumn 3, Issue , 2010, Pages 177-181

  Bera, Chandan ^a,b   Mingo, Natalio ^a   Volz, S ^b  

^a CEA GRENOBLE   (France)

^b ECOLE CENTRALE PARIS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY APPROXIMATIONS; BOUNDARY GEOMETRY; MONTE CARLO CALCULATION; NANOPOROUS MATERIALS; PHONON BOLTZMANN EQUATION; PORE DIAMETERS; SPURIOUS EFFECTS;

BOLTZMANN EQUATION; CARBON FIBER REINFORCED PLASTICS; HEAT TRANSFER; MASS TRANSFER; PLASMA INTERACTIONS; THERMOANALYSIS;

THERMAL CONDUCTIVITY;

EID: 77954321496     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/MNHMT2009-18249     Document Type: Conference Paper

References (29)

1. Ravi Prasher, J. Appl. Phys. 100, 034307 (2006).
2. Ronggui Yang,Gang Chen and Mildred S. Dresselhaus, Phys. Rev. B 72, 125418 (2005).
3. L. D. Hicks and M. S. Dresselhaus, Phys. Rev. B, 47, 12727 (1993).
4. G. Chen, Phys. Rev. B 57, 14958 (1998).
5. R. Venkatasubramanian, E. Siivola, T. Colpitts, and B. O'Quinn, Nature (London) 413, 597 (2001).
6. T. C. Harman, P. J. Taylor, M. P. Walsh, and B. E. LaForge, Science 297, 2229 (2002).
7. C. M. Bhandari and D. M. Rowe, Contemp. Phys. 21, 219 ! (1980).
8. J. D. Chung and M. Kaviany, Int. J. Heat and Mass Transfer 43, 521 (2000).
9. J.-H. Lee,J. C. Grossman,J. Reed and G. Galli, Appl. Phys. Lett. 91,223110(2007).
10. Ronggui Yang and Gang Chen, Phys. Rev. B 69, 195316 (2004).
11. X. W Wang, H. Lee, Y. C. Lan, G. H. Zhu, G. Joshi, D. Z. Wang, J. Yang, A. J. Muto, M. Y. Tang, J. Klatsky, S. Song, M. S. Dresselhaus, G. Chen, and Z. F. Ren, Appl. Phys. Lett. 93,193121 (2008).
12. Giri Joshi, Hohyun Lee, Yucheng Lan, Xiaowei Wang, Gaohua Zhu, Dezhi Wang, Ryan W. Gould, Diana C. Cuff, Ming Y. Tang, Mildred S. Dresselhaus, Gang Chen and Zhifeng Ren, Nano Lett. 8, 4670 (2008)
13. A. Drost, P. Steiner, H. Moser, and W. Lang, Sens. Mater, 7,111(1995).
14. T. M. Kuzay, Rev. Sci. Instrum. 63, 468 (1992).
15. A. Delan, M. Rennau, S. E. Schulz, and T. Gessner, Microelectron. Eng. 70, 280 (2003).
16. R. Prasher, J. Appl. Phys. 100,064302 (2006).
17. S. K. Loyalka, Int. J. Heat Mass Transfer, 12,1513 (1969).
18. S. Mazumder and A. Majumdar, J. Heat Transfer 123, 749 (2001).
19. David Lacroix, Karl Joulain and Denis Lemonnier, Phys. Rev. B 72, 064305 (2005).
20. Jaona Randrianalisoa and Dominique Baillis, J. Appl. Phys. 103, 053502 (2008).
21. S.Volz(Ed.), Microscale and Nanoscale Heat Transfer (Paris,2005), PP.133-153.
22. J. Callaway, Phys Rev. 113,1046 (1959)
23. N.Mingo,Phys. Rev. B 68,113308 (2003).
24. Y.-J. Han and P.G. Klemens, Phys. Rev. B, 48, 6033 (1993).
25. N. Mingo, D. Hauser,N. P. Kobayashi,M. Plissonnier and A. Shakouri Nano left, 9(2), (2009).
26. Abeles, B. Phys. Rev. 1963, 131, (1906).
27. N.Mingo, L. Yamg, D. Li, and A. Majumdar, Nano Lett. (2003).
28. W. Zhang, N. Mingo, and T. S. Fisher 1,Phys. Rev. B 76, 195429 (2007).
29. D. A. Broido and N. Mingo, Phys. Rev. B 74, 195325 (2006).