Some surface and interface characterization and metrology requirements in the wafer processing industry

Surface and Interface Analysis

Volumn 42, Issue 6-7, 2010, Pages 770-774

  Brundle, C R ^a  

^a NONE

Author keywords

Characterization; Metrology; Thin films; Wafer industry; XPS

Indexed keywords

ANALYTICAL METHOD; DEPOSITED LAYER; MATERIALS ANALYSIS; MATERIALS CHARACTERIZATION; METROLOGY; SILICON WAFER PROCESSING; SURFACE AND INTERFACES; THIN FILM ANALYSIS; WAFER INDUSTRY; WAFER PROCESSING; XPS;

INDUSTRY; MEASUREMENTS; SILICON WAFERS; THIN FILMS; VAPOR DEPOSITION; X RAY PHOTOELECTRON SPECTROSCOPY;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 77954252158     PISSN: 01422421     EISSN: 10969918     Source Type: Journal    
DOI: 10.1002/sia.3499     Document Type: Conference Paper

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