Debris-free laser-assisted low-stress dicing for multi-layered MEMS - Separation method of glass layer

IEEJ Transactions on Sensors and Micromachines

Volumn 128, Issue 3, 2008, Pages 91-96

  Izawa, Yusaku ^a   Tsurumi, Yosuke ^a   Tanaka, Shuji ^b   Kikuchi, Hideyuki ^b   Sueda, Keichi ^a   Nakata, Yoshiki ^a   Esashi, Masayoshi ^b   Miyanaga, Noriaki ^a   Fujita, Masayuki ^c  

^a OSAKA UNIVERSITY   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

^c INSTITUTE FOR LASER TECHNOLOGY   (Japan)

Author keywords

Debris free laser dicing; Glass; Internal transformation; MEMS; Noncontact wafer separation; Thermal stress

Indexed keywords

INTERNAL TRANSFORMATION; LASER DICING; NON-CONTACT; NONCONTACT WAFER SEPARATION;

COMPUTER CRIME; DEBRIS; GLASS; GLASS LASERS; MEMS; MICROELECTROMECHANICAL DEVICES; PULSED LASER APPLICATIONS; SEPARATION; THERMAL STRESS; THERMOELASTICITY;

NEODYMIUM LASERS;

EID: 65649105730     PISSN: 13418939     EISSN: 13475525     Source Type: Journal    
DOI: 10.1541/ieejsmas.128.91     Document Type: Conference Paper

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