Debris-free high-speed laser-assisted low-stress dicing for multi-layered MEMS

IEEJ Transactions on Sensors and Micromachines

Volumn 129, Issue 3, 2009, Pages 63-68

  Izawa, Yusaku ^a   Tsurumi, Yosuke ^a   Tanaka, Shuji ^b   Fukushi, Hideyuki ^b   Sueda, Keiichi ^a   Nakata, Yoshiki ^a   Esashi, Masayoshi ^b   Miyanaga, Noriaki ^a   Fujita, Masayuki ^a,c  

^a OSAKA UNIVERSITY   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

^c INSTITUTE FOR LASER TECHNOLOGY   (Japan)

Author keywords

Debris free; Glass; Internal transformation; Laser dicing; MEMS; Silicon; Water free

Indexed keywords

BENDING STRESS; HIGH SPEED LASERS; HIGH-SPEED; INTERNAL TRANSFORMATION; LASER DICING; LASER PULSE WIDTHS; LASER SCANNING SPEED; LASER-ASSISTED; LOW STRESS; MECHANICAL BENDING; MULTI-LAYERED; PYREX GLASS; REPETITION RATES; SEPARATION PROCESS; SI WAFERS;

BENDING (FORMING); DEBRIS; GLASS; LASERS; MEMS; MICROELECTROMECHANICAL DEVICES; PULSED LASER APPLICATIONS; SEMICONDUCTING SILICON COMPOUNDS; SEPARATION; WAFER BONDING;

SILICON WAFERS;

EID: 65149087447     PISSN: 13418939     EISSN: 13475525     Source Type: Journal    
DOI: 10.1541/ieejsmas.129.63     Document Type: Article

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