-
4
-
-
36949000833
-
Thermal-aware task scheduling at the system software level
-
CHOI, J., CHER, C., FRANKE, H., HAMANN, H., WEGER, A., AND BOSE, P. 2007. Thermal-Aware task scheduling at the system software level. In Proceedings of the IEEE International Symposium on Low Power Electronics and Design.
-
(2007)
Proceedings of the IEEE International Symposium on Low Power Electronics and Design
-
-
Choi, J.1
Cher, C.2
Franke, H.3
Hamann, H.4
Weger, A.5
Bose, P.6
-
5
-
-
0030110592
-
Modeling and analysis of substrate coupling in integrated circuits
-
GHARPUREY, R. AND MEYER, R. G. 1996. Modeling and analysis of substrate coupling in integrated circuits. IEEE J. Solid-State Circ. 31, 344.
-
(1996)
IEEE J. Solid-State Circ.
, vol.31
, pp. 344
-
-
Gharpurey, R.1
Meyer, R.G.2
-
6
-
-
33748874422
-
SimPoint 3.0: Faster and more flexible program analysis
-
HAMERLY, G., PERELMAN, E., LAU, J., AND CALDER, B. 2005. SimPoint 3.0: Faster and more flexible program analysis. In Proceedings of the Workshop on Modeling, Benchmarking and Simulation.
-
(2005)
Proceedings of the Workshop on Modeling, Benchmarking and Simulation
-
-
Hamerly, G.1
Perelman, E.2
Lau, J.3
Calder, B.4
-
8
-
-
16244394515
-
Efficient full-chip thermal modeling and analysis
-
LI, P., PILEGGI, L. T., ASHEGHI, M., AND CHANDRA, R. 2004. Efficient full-chip thermal modeling and analysis. In Proceedings of the IEEE/ACM International Conference on Computer-Aided Design (Digital Technology Papers). 319.
-
(2004)
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design (Digital Technology Papers)
, pp. 319
-
-
Li, P.1
Pileggi, L.T.2
Asheghi, M.3
Chandra, R.4
-
9
-
-
33845682138
-
Fast thermal simulation for runtime temperature tracking and management
-
LIU, P., LI, H., JIN, L., WU, W., TAN, S. X.-D., AND YANG, J. 2006. Fast thermal simulation for runtime temperature tracking and management. IEEE Trans. Comput.-Aid. Des. Integr. Circ. Syst. 25, 12, 2882-2893.
-
(2006)
IEEE Trans. Comput.-Aid. Des. Integr. Circ. Syst.
, vol.25
, Issue.12
, pp. 2882-2893
-
-
Liu, P.1
Li, H.2
Jin, L.3
Wu, W.4
Tan, S.X.-D.5
Yang, J.6
-
12
-
-
0032044848
-
Numerically stable green function for modeling and analysis of substrate coupling in integrated circuits
-
NIKNEJAD, A. M., GHARPUREY, R., AND MEYER, R. G. 1998. Numerically stable green function for modeling and analysis of substrate coupling in integrated circuits. IEEE Trans. Comput.-Aid. Des. Integr. Circ. Syst. 17, 305.
-
(1998)
IEEE Trans. Comput.-Aid. Des. Integr. Circ. Syst.
, vol.17
, pp. 305
-
-
Niknejad, A.M.1
Gharpurey, R.2
Meyer, R.G.3
-
18
-
-
34548370973
-
Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design
-
YANG, Y., ZHU, C., GU, Z., SHANG, L., AND DICK, R. P. 2006. Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design. In Proceedings of the IEEE/ACM International Conference on Computer Aided Design. 575-582.
-
(2006)
Proceedings of the IEEE/ACM International Conference on Computer Aided Design
, pp. 575-582
-
-
Yang, Y.1
Zhu, C.2
Gu, Z.3
Shang, L.4
Dick, R.P.5
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