Development of a three dimensional neural sensing device by a stacking method

Sensors

Volumn 10, Issue 5, 2010, Pages 4238-4252

  Chang, Chih Wei ^a   Chiou, Jin Chern ^a,b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b CHINA MEDICAL UNIVERSITY   (Taiwan)

Author keywords

Microassembly; Microprobe array; Three dimensional probe array

Indexed keywords

MICRO ASSEMBLY; MICROPROBE ARRAYS; SIGNAL TRANSMISSION; STACKING PROCEDURE; STRUCTURE STRENGTH; SUPPORTING PLATFORM; THREE DIMENSIONAL PROBES; VERTICAL INTERCONNECTIONS;

SENSORS;

THREE DIMENSIONAL;

EID: 77953501482     PISSN: 14248220     EISSN: None     Source Type: Journal    
DOI: 10.3390/s100504238     Document Type: Article

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