Effects of moist environments on LED module reliability

IEEE Transactions on Device and Materials Reliability

Volumn 10, Issue 2, 2010, Pages 182-186

  Luo, Xiaobing ^a   Wu, Bulong ^a   Liu, Sheng ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Light emitting diodes (LEDs); Moisture; Reliability

Indexed keywords

DIGITAL MICROSCOPY; HIGH-POWER; LIGHT OUTPUT; LIGHT-EMITTING DIODES (LEDS); MODULE RELIABILITY; MOIST CONDITIONS; MOIST ENVIRONMENT; MOISTURE DIFFUSION; OPERATING ENVIRONMENT; REGRESSION RATE; WHITE LED;

DIODES; LIGHT EMISSION; MOISTURE; PACKAGING MATERIALS; RELIABILITY;

LIGHT EMITTING DIODES;

EID: 77953258984     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2009.2038367     Document Type: Article

References (11)

1. H. Aziz and G. Xu, "Degradation processes at the cathode/organic interface in organic light emitting devices with Mg:Ag cathodes," Appl. Phys. Lett., vol.72, no.21, pp. 2642-2644, 1998.
2. A. P. Ghosh, L. J. Gerenser, C. M. Jarman, and J. E. Fornalik, "Thin-film encapsulation of organic light-emitting devices," Appl. Phys. Lett., vol.86, no.22, p. 223 503, 2005.
3. E. H. Wong, R. Rajoo, S. W. Koh, and T. B. Lim, "The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging," ASME J. Electron. Packag., vol.124, no.2, pp. 122-126, 2002.
4. [Online]. Available: www.cree.com
5. J. Z. Hu, L. Q. Yang, and M. W. Shin, "Electrical, optical and thermal degradation of high-power GaN/InGaN light-emitting diodes," J. Phys. D, Appl. Phys., vol.41, no.3, p. 035107, 2008.
6. J. Z. Hu, L. Q. Yang, and M. W. Shin, "Thermal effects of moistureinducing delamination in light-emitting diode packages," in Proc. Electron. Compon. Technol. Conf., 2006, pp. 1957-1962.
7. J. Z. Hu, L. Q. Yang, and M. W. Shin, "Mechanism and thermal effect of delamination in light-emitting diode packages," Microelectron. J., vol.38, no.2, pp. 157-163, Feb. 2007.
8. L. Tan, J. Li, S. Liu, Z. Gan, and K. Wang, "Effect of defects on thermal and optical performance of high-power LEDs," in Proc. 4th China Int. Forum Solid State Lighting, Shanghai, China, 2007, pp. 304-309.
9. K. Wang, S. Liu, F. Chen, Z. Liu, and X. Luo, "Novel applicationspecific LED packaging with compact freeform lens," in Proc. 59th Electron. Compon. Technol. Conf., San Diego, CA, May 26-29, 2009, pp. 2125-2130.
10. D. L. Barton, M. Osinski, P. Perlin, C. J. Helms, and N. H. Berg, "Life tests and failure mechanisms of GaN/AlGaN/InGaN light emitting diodes," Proc. SPIE, vol.3279, pp. 17-27, 1998.
11. X. M.Wang,W. L. Guo, Y. T. Tian, X. Guo, G. Gao, and G. D. Shen, "The reliability of tunnel junction regenerated light emitting diodes," Proc. SPIE, vol.6020, pp. 602 01X.1-602 01X.10, 2005.