Thermal degradation behavior of waste video cards using thermogravimetric analysis and pyrolysis gas chromatography/mass spectrometry techniques

Journal of the Air and Waste Management Association

Volumn 60, Issue 5, 2010, Pages 540-547

  Duan, Huabo ^a   Li, Jinhui ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACETONE; AIR POLLUTION CONTROL; BENZOIC ACID; DEGRADATION; EPOXY RESINS; GAS CHROMATOGRAPHY; INTEGRATED CIRCUITS; MASS SPECTROMETRY; MIXTURES; PHENOLIC RESINS; PHENOLS; PRINTED CIRCUIT BOARDS; PYROLYSIS; SUBSTRATES; WASTE INCINERATION; WASTE TREATMENT;

BROMINATED EPOXY RESINS; DEGRADATION BEHAVIOR; DEGRADATION CHARACTERISTICS; INITIAL TEMPERATURES; INTEGRATED CIRCUITS (ICS); PRINTED CIRCUIT BOARD ASSEMBLY; PYROLYSIS-GAS CHROMATOGRAPHY- MASS SPECTROMETRIES; PYROLYSIS-GAS CHROMATOGRAPHY/MASS SPECTROMETRY;

THERMOGRAVIMETRIC ANALYSIS;

ACETONE; BENZOIC ACID; BROMOTOLUENE; CYCLOTETRASILOXANE; EPOXY RESIN; PHENOL; SILOXANE; TOLUENE DERIVATIVE; UNCLASSIFIED DRUG; PLASTIC;

ARTICLE; CHEMICAL COMPOSITION; GAS ANALYSIS; HEATING; INTEGRATED CIRCUIT; MASS FRAGMENTOGRAPHY; PRIORITY JOURNAL; PYROLYSIS; RECYCLING; THERMOGRAVIMETRY; COMPUTER; HEAT; INCINERATION; INDUSTRIAL WASTE; MICROCOMPUTER;

COMPUTERS; GAS CHROMATOGRAPHY-MASS SPECTROMETRY; HOT TEMPERATURE; INCINERATION; INDUSTRIAL WASTE; MICROCOMPUTERS; PLASTICS; THERMOGRAVIMETRY;

EID: 77953237186     PISSN: 10962247     EISSN: 21622906     Source Type: Journal    
DOI: 10.3155/1047-3289.60.5.540     Document Type: Article

References (35)

1. Takanori, H.; Ryuichi, A.; Youichi, M.; Minoru, N.; Yasuhiro, T.; Takao; A. Techniques to Separate Metal from Waste Printed Circuit Boards from Discarded Personal Computers; J. Mat. Cycles Waste Manage. 2009, 11, 42-54.
2. Zhang, J.H.; Min, H. Eco-Toxicity and Metal Contamination of Paddy Soil in an e-Wastes Recycling Area; J. Hazard. Mat. 2009, 165, 744-750.
3. WEEE & Hazardous Waste; Prepared for the Department for Environment Food and Rural Affairs by AEA Technology: Oxford, United Kingdom, 2004; available at http://www.defra.gov.uk/environment/waste/topics/electrical/pdf/ weee-hazwaste.pdf (accessed 2010).
4. Iwasaki, I.; Pozzo, B.L.; Malicsi, A.S. Removal of Lead from Printed Circuit Board Scrap by Electrolysis-Chemical Precipitation Method; University of Minnesota: St. Paul, MN, 1988; available at http://www.p2pays.org/ ref%5C03/02920.pdf (accessed 2010).
5. Duan, H.B.; Huang, Q.F.; Wang, Q.; Zhou, B.Y.; Li, J.H. Hazardous Waste Generation and Management in China: a Review; J. Hazard. Mat. 2008, 158, 221-227.
6. Submission by the Secretariat of the Basel Convention on the Convention as a Key Instrument in the Environmentally Sound Management of Electrical and Electronic Wastes; International Conference on Chemicals Management Second Session; Secretariat of the Basel Convention: Geneva, Switzerland, 2009; available at http://www.basel.int/pub/broch-bcrc-270508.pdf (accessed 2010).
7. Zebedin, H.; Daichendt, K.; Kopacek, P. A New Strategy for a Flexible Semi-Automatic Disassembling Cell of Printed Circuit Boards. In Proceedings of the 2001 Institute of Electrical and Electronics Engineers (IEEE) International Symposium on Electronics and the Environment; IEEE: Denver, CO, 2001; pp 1742-1746.
8. Knoth, R.; Brandstotter, M.; Kopacek, B.; Kopacek. P. Automated Disassembly of Electr(on)ic Equipment. In Proceedings of the 2002 Institute of Electrical and Electronics Engineers (IEEE) International Symposium on Electronics and the Environment; IEEE: San Francisco, CA, 2002; pp 290-294.
9. Stobbe, I.; Griese, H.; Potter, H.; Reichl, H.; Stobbek, L. Quality Assured Disassembly of Electronic Components for Reuse. In Proceedings of the 2002 Institute of Electrical and Electronics Engineers (IEEE) International Symposium on Electronics and the Environment; IEEE: San Francisco, CA, 2002; pp 299-305.
10. Brandstotter, M.; Knoth, R.; Kopacek, B.; Kopacek, P. Closing the Loop of Printed-Wire-Boards Electronic Devices: Experiences from Automatic Disassembling as an Input for Manufacturers. In Proceedings of the 2004 Institute of Electrical and Electronics Engineers (IEEE) International Symposium on Electronics and the Environment; IEEE: Phoenix, AZ, 2004; pp 182-185.
11. Huang, K.; Guo, J.; Xu, Z.M. Recycling of Waste Printed Circuit Boards: a Review of Current Technologies and Treatment Status in China; J. Hazard. Mat. 2009, 164, 399-406.
12. Li, J.; Shrivastava, P.; Gao, Z.; Zhang, H. Printed Circuit Board Recycling: a State-of-the-art Survey; IEEE Trans. Electron. Packag. Manuf. 2004, 27, 33-42.
13. Chiang, H.L.; Lin, K.H.; Lai, M.H.; Chen, T.C.; Ma, S.Y. Pyrolysis Characteristics of Integrated Circuit Boards at Various Particle Sizes and Temperatures; J. Hazard. Mat. 2007, 149, 151-159.
14. Marco, I.D.; Caballero, B.M.; Chomon, M.J.; Laresgoiti, M.F.; Torres, A.; Fernandez, G.; Arnaiz, S. Pyrolysis of Electrical and Electronic Wastes; J. Anal. Appl. Pyrolysis 2008, 82, 179-183.
15. Antonetti, P.; Flitris, Y.; Flamant, G.; Hellio, H.; Gauthier, D.; Granier, B. Degradation Products of the Process of Thermal Recovery of Copper from Lamina Scraps in Lab-Scale Fluidized Bed Reactor; J. Hazard. Mat. 2004, 108, 199-206.
16. Cui, J.; Zhang, L. Metallurgical Recovery of Metals from Electronic Waste: a Review; J. Hazard. Mat. 2008, 158, 228-256.
17. Oh, C.J.; Lee, S.O.; Yang, H.S.; Ha, T.J.; Kim, M.J. Selective Leaching of Valuable Metals from Waste Printed Circuit Boards; J. Air & Waste Manage. Assoc. 2003, 53, 897-902.
18. Guo, J.; Rao, Q.; Xu, Z.H. Application of Glass-Nonmetals of Waste Printed Circuit Boards to Produce Phenolic Moulding Compound; J. Hazard. Mat. 2008, 153, 728-734.
19. Yuan, J.; Packowski, M.A. The Thermal Degradation and Decomposition of Brominated Epoxy FR-4 Laminates. In Proceedings of the 1993 Institute of Electrical and Electronics Engineers (IEEE) The 43rd Electronic Components & Technology Conference; IEEE: Orlando, FL, 1993; pp 330-335.
20. William, J.H.; Paul, T.W. Analysis of Products from the Pyrolysis of Plastics Recovered from the Commercial Scale Recycling of Waste Electrical and Electronic Equipment; J. Anal. Appl. Pyrolysis 2007, 79, 375-386.
21. Chen, K.S.; Yeh, R.Z. Pyrolysis Kinetics of Epoxy Resin in a Nitrogen Atmosphere; J. Hazard. Mat. 1996, 49, 105-113.
22. Quan, C.; Li, A.M.; Gao, N.B. Thermogravimetric Analysis and Kinetic Study on Large Particles of Printed Circuit Board Wastes; Waste Manage. 2009, 29, 2353-2360.
23. Guan, J.; Li, Y.S.; Lu, M.X. Product Characterization of Waste Printed Circuit Board by Pyrolysis; J. Anal. Appl. Pyrolysis 2008, 83, 185-189.
24. Liou, T.H. Kinetics Study of Thermal Decomposition of Electronic Packaging Material; Chem. Eng. J. 2004, 98, 39-51.
25. Mazzocchia, C.; Kaddouri, A.; Modica, G.; Nannicini, R.; Audisio, G.; Barbieri, C.; Bertini, F. Hardware Components Wastes Pyrolysis: Energy Recovery and Liquid Fraction Valorisation; J. Anal. Appl. Pyrolysis 2003, 70, 263-276.
26. Molto, J.; Font, R.; Galvez, A.; Conesa, J.A. Pyrolysis and Combustion of Electronic Wastes; J. Anal. Appl. Pyrolysis 2009, 84, 68-78.
27. Wang, Q.; Shi, W. Kinetics Study of Thermal Decomposition of Epoxy Resins Containing Flame Retardant Components; Polym. Degrad. Stab. 2006, 91, 1747-1754.
28. Sergei, V.L.; Edward, D.W. Thermal Decomposition, Combustion and Flame-Retardancy of Epoxy Resins - a Review of the Recent Literature; Polym. Int. 2004, 53, 1901-1929.
29. Barontini, F.; Cozzani, V. Formation of Hydrogen Bromide and Organobrominated Compounds in the Thermal Degradation of Electronic Boards; J. Anal. Appl. Pyrolysis 2006, 77, 41-55.
30. Blazso, M.; Czegeny, Z.; Csoma, C. Pyrolysis and Debromination of Flame Retarded Polymers of Electronic Scrap Studied by Analytical Pyrolysis; J. Anal. Appl. Pyrolysis 2002, 64, 249-261.
31. Chien, Y.C.; Wang, H.P.; Lin, K.S.; Huang, Y.J.; Yang, Y.W. Fate of Bromine in Pyrolysis of Printed Circuit Board Wastes; Chemosphere 2000, 40, 383-387.
32. Kowalska, E.; Radomska, J.; Konarski, P.; Diduszko, R.; Oszczudłowski, J.; Opalińska, T.; Wieȩch, M.; Duszyc, Z. Thermogravimetric Investigation of Wastes from Electrical and Electronic Equipment (WEEE); J. Therm. Anal. Calorim. 2006, 86, 137-140.
33. Sponton, M.; Mercado, L.A.; Ronda, J.C.; Galia, M.; Cadiz, V. Preparation, Thermal Properties and Flame Retardancy of Phosphorus- and Silicon-Containing Epoxy Resins; Polym. Degrad. Stab. 2008, 93, 2025-2031.
34. Parra, D.F.; Mercuri, L.P.; Matos, J.R.; Brito, H.F.; Romano, R.R. Thermal Behavior of the Epoxy and Polyester Powder Coatings Using Thermogravimetry/Differential Thermal Analysis Coupled GC/Mass Spectrometry (TG/DTA-GC/MS) Technique: Identification of the Degradation Products; Thermochim. Acta 2002, 386, 143-151.
35. Luda, M.P.; Balabanovich, A.I.; Camino, G. Thermal Decomposition of Fire Retardant Brominated Epoxy Resins; J. Analy. Appl. Pyrolysis 2002, 65, 25-40.