Thermogravimetric investigation of wastes from electrical and electronic equipment (WEEE)

Journal of Thermal Analysis and Calorimetry

Volumn 86, Issue 1, 2006, Pages 137-140

  Kowalska, E ^a   Radomska, J ^a   Konarski, P ^a   Diduszko, R ^a,b   Oszczudlowski J ^c   Opalinska T ^a   Wiech M ^a   Duszyc, Z ^d  

^a TELE AND RADIO RESEARCH INSTITUTE   (Poland)

^b Department of Micro and Nanotechnology of Wide Bandgap Semiconductors   (Poland)

^c JAN KOCHANOWSKI UNIVERSITY   (Poland)

^d Center of Wastes Management ^*  (Poland)

Author keywords

Electronic waste; Printed circuit boards; Pyrolysis; Thermal treatment

Indexed keywords

FLUORESCENCE; HEAT TREATMENT; PRINTED CIRCUIT BOARDS; PYROLYSIS; THERMODYNAMIC STABILITY;

ELECTRONIC WASTES; THERMAL WASTE DEGRADATION; X-RAY FLUORESCENCE;

WASTES;

EID: 33749320089     PISSN: 13886150     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10973-006-7589-z     Document Type: Conference Paper

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