3D supercapacitor using nickel electroplated vertical aligned carbon nanotube array electrode

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2010, Pages 1171-1174

  Jiang, Yingqi ^a   Wang, Pengbo ^a,b   Zhang, Jie ^a,c   Li, Wei ^b   Lin, Liwei ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b CHINA AGRICULTURAL UNIVERSITY   (China)

^c CHONGQING UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNED CARBON NANOTUBES; CHARGE/DISCHARGE TEST; ELECTROPLATED NICKEL; ENERGY DENSITY; NICKEL NANOPARTICLES; ORDER OF MAGNITUDE; ROBUST OPERATION; SUPER CAPACITOR; THREE-DIMENSIONAL (3D); UNIFORM DEPOSITION; VERTICALLY ALIGNED CARBON NANOTUBE;

CAPACITORS; ELECTROLYTIC CAPACITORS; MECHANICAL ENGINEERING; MECHANICS; MICROELECTROMECHANICAL DEVICES; NANOPARTICLES; NICKEL; NICKEL ALLOYS; NICKEL COATINGS; NICKEL PLATING; REACTIVE ION ETCHING; THREE DIMENSIONAL;

CARBON NANOTUBES;

EID: 77952774396     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2010.5442420     Document Type: Conference Paper

References (12)

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