Numerical simulation of laminar flow and heat transfer inside a microchannel with one dimpled surface

Journal of Electronic Packaging

Volumn 129, Issue 1, 2007, Pages 63-70

  Wei, X J ^a,b   Joshi, Y K ^b   Ligrani, P M ^c  

^a IBM   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c UNIVERSITY OF OXFORD   (United Kingdom)

Author keywords

Dimple; Heat transfer enhancement; Microchannel

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; FLOW PATTERNS; FLOW VELOCITY; HEAT TRANSFER; LAMINAR FLOW;

DIMPLED SURFACES; FLOW DIRECTIONS; FOOTPRINT DIAMETER;

MICROCHANNELS;

EID: 38749100540     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2429711     Document Type: Article

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