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Volumn 7, Issue 3-4, 2010, Pages 786-789
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A-SiC:H films deposited by PECVD for MEMS applications
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Author keywords
[No Author keywords available]
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Indexed keywords
A-SIC:H;
AS-DEPOSITED FILMS;
DEPOSITION CONDITIONS;
MEMS APPLICATIONS;
PLASMA CONDITIONS;
POST DEPOSITION ANNEALING;
POWER DENSITIES;
STRESS FREE;
YOUNG'S MODULUS;
CHEMICAL VAPOR DEPOSITION;
SILICON CARBIDE;
PLASMA DEPOSITION;
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EID: 77952557995
PISSN: 18626351
EISSN: 16101642
Source Type: Journal
DOI: 10.1002/pssc.200982888 Document Type: Conference Paper |
Times cited : (11)
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References (16)
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