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Volumn 96, Issue 17, 2010, Pages

Mechanically flexible thin film transistors and logic gates on plastic substrates by use of single-crystal silicon wires from bulk wafers

(5) Lee, Seoung Ki a,b Jang, Houk a,b Hasan, Musarrat c Koo, Jae Bon b,c Ahn, Jong Hyun a,b

a Sungkyunkwan University (South Korea)

b Sungkyunkwan University (South Korea)

c Electronics and Telecommunications Research Institute (ETRI) (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BULK WAFERS; ELECTRICAL MEASUREMENT; EXCELLENT PERFORMANCE; FLEXIBLE ELECTRONIC SYSTEMS; FLEXIBLE THIN FILMS; ON/OFF RATIO; PLASTIC SUBSTRATES; SINGLE CRYSTAL SILICON; SUBTHRESHOLD; SUPPLY VOLTAGES; TRANSFER PRINTING; VOLTAGE GAIN;

SEMICONDUCTING SILICON COMPOUNDS; THIN FILM TRANSISTORS; WIRE;

SILICON WAFERS;

EID: 77952344890 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.3409475 Document Type: Article

Times cited : (21)

References (13)

1
- 2342486652
- The path to ubiquitous and low-cost organic electronic appliances on plastic
- DOI 10.1038/nature02498
- S. R. Forrest, Nature (London) NATUAS 0028-0836 428, 911 (2004). 10.1038/nature02498 (Pubitemid 38568095)
- (2004) Nature , vol.428 , Issue.6986 , pp. 911-918
- Forrest, S.R.¹

2
- 23144448493
- Macroelectronics: Perspectives on technology and applications
- DOI 10.1109/JPROC.2005.851237, Flexible Electronics Technology Part 1: Systems and Applications
- R. H. Reuss, B. R. Chalamala, A. Moussessian, M. G. Kane, A. Kumar, D. C. Zhang, J. A. Rorers, M. Hatalis, D. Temple, G. Moddel, B. J. Eliasson, M. J. Estes, J. Kunze, E. S. Handy, E. S. Harmon, D. B. Salzman, J. M. Woodall M. Ashraf Alam, J. Y. Murthy, S. C. Jacobsen, M. Olivier, D. Markus, P. M. Campbell, and E. Snow, Proc. IEEE IEEPAD 0018-9219 93, 1239 (2005). 10.1109/JPROC.2005.851237 (Pubitemid 41084571)
- (2005) Proceedings of the IEEE , vol.93 , Issue.7 , pp. 1239-1256
- Reuss, R.H.¹ Chalamala, B.R.² Moussessian, A.³ Kane, M.G.⁴ Kumar, A.⁵ Zhang, D.C.⁶ Rogers, J.A.⁷ Hatalis, M.⁸ Temple, D.⁹ Moddel, G.¹⁰ Eliasson, B.J.¹¹ Estes, M.J.¹² Kunze, J.¹³ Handy, E.S.¹⁴ Harmon, E.S.¹⁵ Salzman, D.B.¹⁶ Woodall, J.M.¹⁷ Alam, M.A.¹⁸ Murthy, J.Y.¹⁹ Jacobsen, S.C.²⁰ more..

3
- 0032493571
- SSCOA4 0038-1098. 10.1016/S0038-1098(98)00209-9
- C. M. Lieber, Solid State Commun. SSCOA4 0038-1098 107, 607 (1998). 10.1016/S0038-1098(98)00209-9
- (1998) Solid State Commun. , vol.107 , pp. 607
- Lieber, C.M.¹

4
- 0348112526
- High-performance nanowire electronics and photonics on glass and plastic substrates
- DOI 10.1021/nl0346427
- M. C. McAlpine, R. S. Friedman, S. Jin, K. -h. Lin, W. U. Wang, and C. M. Lieber, Nano Lett. NALEFD 1530-6984 3, 1531 (2003). 10.1021/nl0346427 (Pubitemid 37521291)
- (2003) Nano Letters , vol.3 , Issue.11 , pp. 1531-1535
- McAlpine, M.C.¹ Friedman, R.S.² Jin, S.³ Lin, K.-H.⁴ Wang, W.U.⁵ Lieber, C.M.⁶

5
- 34047143923
- Layer-by-layer assembly of nanowires for three-dimensional, multifunctional electronics
- DOI 10.1021/nl063056l
- A. Javey, S. Nam, R. S. Friedman, H. Yan, and C. M. Lieber, Nano Lett. NALEFD 1530-6984 7, 773 (2007). 10.1021/nl063056l (Pubitemid 46516064)
- (2007) Nano Letters , vol.7 , Issue.3 , pp. 773-777
- Javey, A.¹ Nam, S.² Friedman, R.S.³ Yan, H.⁴ Lieber, C.M.⁵

6
- 0037418895
- Ultrahigh-density nanowire lattices and circuits
- DOI 10.1126/science.1081940
- N. A. Melosh, A. Boukai, F. Diana, B. Gerardot, A. Badolato, P. M. Petroff, and J. R. Heath, Science SCIEAS 0036-8075 300, 112 (2003). 10.1126/science.1081940 (Pubitemid 36423039)
- (2003) Science , vol.300 , Issue.5616 , pp. 112-115
- Melosh, N.A.¹ Boukai, A.² Diana, F.³ Gerardot, B.⁴ Badolato, A.⁵ Petroff, P.M.⁶ Heath, J.R.⁷

7
- 3242707892
- APPLAB 0003-6951. 10.1063/1.1767591
- E. Menard, K. J. Lee, D. Y. Khang, R. G. Nuzzo, and J. A. Rogers, Appl. Phys. Lett. APPLAB 0003-6951 84, 5398 (2004). 10.1063/1.1767591
- (2004) Appl. Phys. Lett. , vol.84 , pp. 5398
- Menard, E.¹ Lee, K.J.² Khang, D.Y.³ Nuzzo, R.G.⁴ Rogers, J.A.⁵

8
- 13244295503
- Photolithographic route to the fabrication of micro/nanowires of III-V semiconductors
- DOI 10.1002/adfm.200400411
- Y. Sun, D. -Y. Khang, F. Hua, K. Hurley, R. G. Nuzzo, and J. A. Rogers, Adv. Funct. Mater. AFMDC6 1616-301X 15, 30 (2005). 10.1002/adfm.200400411 (Pubitemid 40183834)
- (2005) Advanced Functional Materials , vol.15 , Issue.1 , pp. 30-40
- Sun, Y.¹ Khang, D.-Y.² Hua, F.³ Hurley, K.⁴ Nuzzo, R.G.⁵ Rogers, J.A.⁶

9
- 34249696029
- Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon
- DOI 10.1063/1.2742294
- J. -H. Ahn, H. -S. Kim, E. Menard, K. J. Lee, Z. Zhu, D. -H. Kim, R. G. Nuzzo, and J. A. Rogers, Appl. Phys. Lett. APPLAB 0003-6951 90, 213501 (2007). 10.1063/1.2742294 (Pubitemid 46828114)
- (2007) Applied Physics Letters , vol.90 , Issue.21 , pp. 213501
- Ahn, J.-H.¹ Kim, H.-S.² Menard, E.³ Lee, K.J.⁴ Zhu, Z.⁵ Kim, D.-H.⁶ Nuzzo, R.G.⁷ Rogers, J.A.⁸ Amlani, I.⁹ Kushner, V.¹⁰ Thomas, S.G.¹¹ Duenas, T.¹²

10
- 33845445505
- Microwave thin-film transistors using Si nanomembranes on flexible polymer substrate
- DOI 10.1063/1.2397038
- H. -C. Yuan and Z. Ma, Appl. Phys. Lett. APPLAB 0003-6951 89, 212105 (2006). 10.1063/1.2397038 (Pubitemid 44892288)
- (2006) Applied Physics Letters , vol.89 , Issue.21 , pp. 212105
- Yuan, H.-C.¹ Ma, Z.²

11
- 33744530680
- Mechanically flexible thin-film transistors that use ultrathin ribbons of silicon derived from bulk wafers
- DOI 10.1063/1.2206688
- S. Mack, M. A. Meitl, A. J. Baca, Z. -T. Zhu, and J. A. Rogers, Appl. Phys. Lett. APPLAB 0003-6951 88, 213101 (2006). 10.1063/1.2206688 (Pubitemid 43814844)
- (2006) Applied Physics Letters , vol.88 , Issue.21 , pp. 213101
- MacK, S.¹ Meitl, M.A.² Baca, A.J.³ Zhu, Z.-T.⁴ Rogers, J.A.⁵

12
- 36148942881
- Printable single-crystal silicon micro/nanoscale ribbons, platelets and bars generated from bulk wafers
- DOI 10.1002/adfm.200601161
- A. J. Baca, M. A. Meitl, H. C. Ko, S. Mack, H. -S. Kim, J. Dong, P. M. Ferreira, and J. A. Rogers, Adv. Funct. Mater. AFMDC6 1616-301X 17, 3051 (2007). 10.1002/adfm.200601161 (Pubitemid 350103439)
- (2007) Advanced Functional Materials , vol.17 , Issue.16 , pp. 3051-3062
- Baca, A.J.¹ Meitl, M.A.² Ko, H.C.³ Mack, S.⁴ Kim, H.-S.⁵ Dong, J.⁶ Ferreira, P.M.⁷ Rogers, J.A.⁸

13
- 4544326818
- TDIMD5 0163-1918
- M. Yang, M. Leong, L. Shi, K. Chan, V. Chant, A. Chout, E. Gusev, K. Jenkins, D. Boyd, Y. Ninomiya, D. Pendleton, Y. Surpris, D. Heenan, J. Ott, K. Guarini, C. D'Emic, M. Cobb, P. Mooney, B. To, N. Rovedo, J. Benedict, R. Mo, and H. Ng, Tech. Dig.-Int. Electron Devices Meet. TDIMD5 0163-1918 2003, 453.
- Tech. Dig. - Int. Electron Devices Meet. , vol.2003 , pp. 453
- Yang, M.¹ Leong, M.² Shi, L.³ Chan, K.⁴ Chant, V.⁵ Chout, A.⁶ Gusev, E.⁷ Jenkins, K.⁸ Boyd, D.⁹ Ninomiya, Y.¹⁰ Pendleton, D.¹¹ Surpris, Y.¹² Heenan, D.¹³ Ott, J.¹⁴ Guarini, K.¹⁵ D'Emic, C.¹⁶ Cobb, M.¹⁷ Mooney, P.¹⁸ To, B.¹⁹ Rovedo, N.²⁰ more..

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