Technology roadmapping for Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC)

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn , Issue , 2010, Pages 525-532

  Foley, Raymond ^a   Waldron, Finbarr ^b   Slowey, John ^a   Alderman, Arnold ^c   Narveson, Brian ^d   Ó'Mathúna, Sean Cian ^b  

^a UNIVERSITY COLLEGE CORK   (Ireland)

^b UNIVERSITY COLLEGE CORK   (Ireland)

^c Anagenesis Inc   (United States)

^d TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY TECHNOLOGY; COMMERCIAL DEVELOPMENT; COMMERCIAL PRODUCTS; POWER DENSITIES; POWER SUPPLY; POWER SUPPLY-ON-CHIP; TECHNOLOGY ROADMAPPING; THERMAL PERFORMANCE ANALYSIS;

MONOPOLE ANTENNAS; POWER ELECTRONICS; TECHNOLOGY;

COMPUTER CRIME;

EID: 77952234499     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2010.5433622     Document Type: Conference Paper

References (14)

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