SCOPUS 정보 검색 플랫폼

IEEJ Transactions on Electrical and Electronic Engineering

Volumn 5, Issue 2, 2010, Pages 175-180

Vacuum packaging technology for uncooled infrared sensor

(6) Kimata, Masafumi a Tokuda, Member Takayuki a Tsuchinaga, Akinobu a Matsumura, Takeshi a Abe, Hideyuki b Tokashiki, Naotaka c

a RITSUMEIKAN UNIVERSITY (Japan)

b Ayumi Industry Co LTD (Japan)

c Miyoshi Electronics Corporation (Japan)

Author keywords

MEMS; Micro vacuum gauge; Uncooled infrared focal plane array; Vacuum packaging

Indexed keywords

CONSTRUCTION EQUIPMENT; FOCAL PLANE ARRAYS; FOCUSING; GAGES; HEATING; INFRARED DETECTORS; PACKAGING; SOLDERING; VACUUM GAGES; VACUUM TECHNOLOGY;

AIR MOLECULES; BATCH SIZES; FABRICATION PROCESS; HIGH-VACUUM CONDITIONS; MASS PRODUCTION; OPERATION PRINCIPLES; THERMAL CONDUCTION; UNCOOLED INFRARED; UNCOOLED INFRARED FOCAL PLANE ARRAYS; UNIFORM HEATING; VACUUM GAUGES; VACUUM LEVEL; VACUUM PACKAGING;

VACUUM;

EID: 77952184654 PISSN: 19314973 EISSN: 19314981 Source Type: Journal
DOI: 10.1002/tee.20514 Document Type: Article

Times cited : (11)

References (7)

1
- 0029484035
- Semiconductor film bolometer technology for uncooled IR sensors
- Unewisse MH, Liddiard KC, Craig BI, Passmore SJ, Watson RJ, Clarke RE, Reinhold O. Semiconductor film bolometer technology for uncooled IR sensors. Proceedings of SPIE 1995; 2552:77-87.
- (1995) Proceedings of SPIE , vol.2552 , pp. 77-87
- Unewisse, M.H.¹ Liddiard, K.C.² Craig, B.I.³ Passmore, S.J.⁴ Watson, R.J.⁵ Clarke, R.E.⁶ Reinhold, O.⁷

2
- 0036907264
- Thin-film ferroelectric: breakthrough
- Hanson CM, Beratan HR. Thin-film ferroelectric: breakthrough. Proceedings of SPIE 2002; 4721:91-99.
- (2002) Proceedings of SPIE , vol.4721 , pp. 91-99
- Hanson, C.M.¹ Beratan, H.R.²

3
- 0032632172
- Advances in amorphous silicon uncooled IR systems
- Brady J, Schimert T, Ratcliff D, Gooch R, Ritchey B, McCardel P, Rachels K, Ropson S, Wand M, Weinstein W, Wynn J. Advances in amorphous silicon uncooled IR systems. Proceedings of SPIE 1999; 3698:161-167.
- (1999) Proceedings of SPIE , vol.3698 , pp. 161-167
- Brady, J.¹ Schimert, T.² Ratcliff, D.³ Gooch, R.⁴ Ritchey, B.⁵ McCardel, P.⁶ Rachels, K.⁷ Ropson, S.⁸ Wand, M.⁹ Weinstein, W.¹⁰ Wynn, J.¹¹

4
- 4344698979
- Infrared microbolometer sensors and their application in automotive safety
- Yon JJ. Infrared microbolometer sensors and their application in automotive safety. Proceedings of AMAA 2003 Conference 2003; 137-157.
- (2003) Proceedings of AMAA 2003 Conference , pp. 137-157
- Yon, J.J.¹

5
- 10044237909
- Advanced packaging development for very low cost uncooled IRFPA
- Astier A, Arnaud A, Ouvrier-Buffet JL, Yon JJ, Motin E. Advanced packaging development for very low cost uncooled IRFPA. Proceedings of SPIE 2004; 5406:412-421.
- (2004) Proceedings of SPIE , vol.5406 , pp. 412-421
- Astier, A.¹ Arnaud, A.² Ouvrier-Buffet, J.L.³ Yon, J.J.⁴ Motin, E.⁵

6
- 33747678708
- Uncooled IRFPA with chip scale vacuum package
- Hata H, Nakaki Y, Inoue H, Kosasayama Y, Ohta Y, Fukumoto H, Seto T, Kama K, Takeda M, Kimata M. Uncooled IRFPA with chip scale vacuum package. Proceedings of SPIE 2006; 6206:620612-1-620619-10.
- (2006) Proceedings of SPIE , vol.6206 , pp. 6206121-62061910
- Hata, H.¹ Nakaki, Y.² Inoue, H.³ Kosasayama, Y.⁴ Ohta, Y.⁵ Fukumoto, H.⁶ Seto, T.⁷ Kama, K.⁸ Takeda, M.⁹ Kimata, M.¹⁰

7
- 45549101974
- Innovative on-chip packaging applied to uncooled IRFPA
- Dumont G, Arnaud A, Imperinetti P, Vialle C, Rabaud W, Goudon V, Yon JJ. Innovative on-chip packaging applied to uncooled IRFPA. Proceedings of SPIE 2008; 6940:69401Y-1-69401Y-6.
- (2008) Proceedings of SPIE , vol.6940
- Dumont, G.¹ Arnaud, A.² Imperinetti, P.³ Vialle, C.⁴ Rabaud, W.⁵ Goudon, V.⁶ Yon, J.J.⁷

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.