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Volumn 53, Issue , 2010, Pages 110-111

A 4.1Tb/s bisection-bandwidth 560Gb/s/W streaming circuit-switched 8x8 mesh network-on-chip in 45nm CMOS

Author keywords

[No Author keywords available]

Indexed keywords

BISECTION BANDWIDTH; CIRCUIT-SWITCHED NETWORKS; DATA INTERCONNECT; DATA STORAGE; DATA WIDTH; DYNAMIC OPTIMIZATION; ENERGY EFFICIENT; HIGH BANDWIDTH; HIGH THROUGHPUT; INTERCONNECT NETWORKS; LOW ENERGIES; LOW LATENCY; LOW-VOLTAGE; MAXIMUM THROUGH-PUT; MESH NETWORK; METAL-GATE; MULTI-CORE PROCESSOR; NETWORK POWER; PACKET-SWITCHED; POWER SAVINGS; RE-CONFIGURABLE; ROUTE DATA; SCALABLE PERFORMANCE; STREAMING TRAFFIC; SWITCHED CHANNELS; TRAFFIC PATTERN;

EID: 77952175242     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2010.5434078     Document Type: Conference Paper
Times cited : (16)

References (4)
  • 1
    • 49549108733 scopus 로고    scopus 로고
    • TILE64 - Processor: A 64-Core SoC with Mesh Interconnect
    • S. Bell et al., "TILE64 - Processor: A 64-Core SoC with Mesh Interconnect," ISSCC, pp. 88-89, 2008.
    • (2008) ISSCC , pp. 88-89
    • Bell, S.1
  • 2
    • 0037969181 scopus 로고    scopus 로고
    • A 16-issue multiple-program-counter microprocessor with point-to-point scalar operand network
    • M. Taylor et al., "A 16-issue multiple-program-counter microprocessor with point-to-point scalar operand network," ISSCC, pp. 170-171, 2003.
    • (2003) ISSCC , pp. 170-171
    • Taylor, M.1
  • 3
    • 58049111166 scopus 로고    scopus 로고
    • A 2.9Tb/s 8W 64-Core Circuit-switched Network-on-Chip in 45nm CMOS
    • M. Anders et al., "A 2.9Tb/s 8W 64-Core Circuit-switched Network-on-Chip in 45nm CMOS," ESSCIRC, pp. 182-185, 2008.
    • (2008) ESSCIRC , pp. 182-185
    • Anders, M.1
  • 4
    • 50249185641 scopus 로고    scopus 로고
    • A 45nm Logic Technology with High-k+Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging
    • K. Mistry et al., "A 45nm Logic Technology with High-k+Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging," IEDM, pp. 247-250, 2007.
    • (2007) IEDM , pp. 247-250
    • Mistry, K.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.