Thermal assisted ultrasonic bonding method for poly(methyl methacrylate) (PMMA) microfluidic devices

Talanta

Volumn 81, Issue 4-5, 2010, Pages 1331-1338

  Zhang, Zongbo ^a   Wang, Xiaodong ^a   Luo, Yi ^a   He, Shengqiang ^a   Wang, Liding ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Microfluidic device; Micromixer; Thermal assisted ultrasonic bonding; Ultrasonic welding

Indexed keywords

ESTERS; FLUIDIC DEVICES; GLASS TRANSITION; INTERFACES (MATERIALS); MICROFLUIDICS; MIXERS (MACHINERY); TAGUCHI METHODS; ULTRASONIC EFFECTS; ULTRASONIC WELDING;

BONDING TECHNIQUES; BULK TEMPERATURES; MICRO MIXERS; MICRO-FLUIDIC DEVICES; MICROFLUIDIC CHIP; POLY(METHYL METHACRYLATE) (PMMA); ULTRASONIC BONDING; ULTRASONIC VIBRATION;

ULTRASONIC APPLICATIONS;

COLORING AGENT; PLASTIC; POLY(METHYL METHACRYLATE); POLYMER;

CHEMISTRY; DEVICES; EQUIPMENT DESIGN; HEAT; MATERIALS TESTING; MICROFLUIDIC ANALYSIS; MICROFLUIDICS; PROCEDURES; TEMPERATURE; TENSILE STRENGTH; ULTRASOUND;

COLORING AGENTS; EQUIPMENT DESIGN; HOT TEMPERATURE; MATERIALS TESTING; MICROFLUIDIC ANALYTICAL TECHNIQUES; MICROFLUIDICS; PLASTICS; POLYMERS; POLYMETHYL METHACRYLATE; TEMPERATURE; TENSILE STRENGTH; ULTRASONICS;

EID: 77952101829     PISSN: 00399140     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.talanta.2010.02.031     Document Type: Article

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