Growth of pagoda-topped tetragonal copper nanopillar arrays

ACS Applied Materials and Interfaces

Volumn 1, Issue 7, 2009, Pages 1375-1378

  Chang, I Chun ^a   Huang, Ting Kai ^a   Lin, Huang Kai ^a   Tzeng, Yu Feng ^a   Peng, Chih Wei ^a   Pan, Fu Ming ^a   Lee, Chi Young ^b   Chiu, Hsin Tien ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

copper; electrochemical reduction; field emission; nanopillar; pagoda

Indexed keywords

DODECYLTRIMETHYLAMMONIUM CHLORIDE; ELECTROCHEMICAL REDUCTIONS; FIELD EMISSION MEASUREMENTS; FIELD ENHANCEMENT FACTOR; NANO-PILLAR ARRAYS; NANOPILLAR; NANOPILLARS; PAGODA; TURN-ON FIELD;

CHLORINE COMPOUNDS; COPPER; COPPER COMPOUNDS; ELECTROCHEMISTRY; ELECTROLYTIC REDUCTION; FIELD EMISSION;

TOWERS;

ALUMINUM; COPPER; GLASS; NANOPARTICLE;

CHEMISTRY; ELECTROCHEMISTRY; ELECTRODE; EQUIPMENT DESIGN; LETTER; MATERIALS TESTING; METHODOLOGY; NANOTECHNOLOGY; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTY; TRANSMISSION ELECTRON MICROSCOPY;

ALUMINUM; COPPER; ELECTROCHEMISTRY; ELECTRODES; EQUIPMENT DESIGN; GLASS; MATERIALS TESTING; MICROSCOPY, ELECTRON, SCANNING; MICROSCOPY, ELECTRON, TRANSMISSION; NANOPARTICLES; NANOTECHNOLOGY; SURFACE PROPERTIES;

EID: 77951625307     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am900264u     Document Type: Article

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