Electrochemical fabrication of single-crystalline and polycrystalline Au nanowires: The influence of deposition parameters

Nanotechnology

Volumn 17, Issue 8, 2006, Pages 1922-1926

  Liu, J ^a   Duan, J L ^a   Toimil Molares, M E ^b   Karim, S ^c   Cornelius, T W ^b   Dobrev, D ^b   Yao, H J ^a   Sun, Y M ^a   Hou, M D ^a   Mo, D ^a   Wang, Z G ^a   Neumann, R ^b  

^a INSTITUTE OF MODERN PHYSICS   (China)

^b GSI HELMHOLTZZENTRUM FÜR SCHWERIONENFORSCHUNG GMBH   (Germany)

^c PHILIPPS UNIVERSITY MARBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; ELECTROCHEMISTRY; GOLD; POLYCRYSTALLINE MATERIALS; SINGLE CRYSTALS; SYNTHESIS (CHEMICAL); X RAY DIFFRACTION ANALYSIS;

ELECTROCHEMICAL GROWTH; GOLD SULFITE ELECTROLYTES; ION-TRACK MEMBRANES;

NANOSTRUCTURED MATERIALS;

EID: 33645314693     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/17/8/020     Document Type: Article

References (24)

1. Williams W D and Giordano N 1986 Phys. Rev. B 33 8146
2. Whitney T M, Jiang J S, Searson P C and Chien C L 1993 Science 261 1316
3. Blondel A, Meler J P, Doudin B and Ansermet J Ph 1994 Appl. Phys. Lett. 65 3019
4. Dubois S, Michel A, Eymery J P, Duvail J L and Piraux L 1999 J. Mater. Res. 14 665
5. Huczko A 2000 Appl. Phys. A 70 365-76
6. Xia Y, Yang P, Sun Y, Wu Y, Mayers B, Gates B, Yin Y, Kim F and Yan H 2003 Adv. Mater. 15 353
7. Yun M, Myung N V, Vasquez R P, Lee C, Menke E and Penner R M 2004 Nano Lett. 4 419
8. Mohamed M B, Volkov V, Link S and El-Sayed M A 2000 Chem. Phys. Lett. 317 517
9. Gu J L, Shi J L, Xiong L M, Chen H R, Li L and Ruan M L 2004 Solid State Sci. 6 747
10. Huang Y J, Li D and Li J H 2004 Chem. Phys. Lett. 389 14
11. Tsuji M, Hashimoto M, Nishizawa Y and Tsuji T 2004 Mater. Lett. 58 2326
12. Durkan C and Welland M E 2000 Phys. Rev. B 61 14215
13. Martin C R 1996 Chem. Mater. 8 1739
14. Zhang Z, Gekhtman D, Dresselhaus M S and Ying J Y 1999 Chem. Mater. 11 1659
15. Limmer S J, Seraji S, Forbess M J, Wu Y, Chou T P, Nguyen C and Cao G 2001 Adv. Mater. 13 1269
16. Toimil-Molares M E, Buschmann V, Dobrev D, Neumann R, Scholz R, Schuchert I U and Vetter J 2001 Adv. Mater. 13 62
17. Possin G E 1970 Rev. Sci. Instrum. 41 772
18. Toimil-Molares M E, Brötz J, Buschmann V, Dobrev D, Neumann R, Scholz R, Schuchert I U, Trautmann C and Vetter J 2001 Nucl. Instrum. Methods B 185 192
19. Chrzanowski W, Li Y G and Lasia A 1996 J. Appl. Electrochem. 26 385
20. Schlesinger M and Paunovic M 2000 Modern Electroplating (New York: Wiley-Interscience)
21. Dobrev D, Vetter J, Angert N and Neumann R 2000 Electrochim. Acta 45 3117
22. Hall E O 1951 Proc. Phys. Soc. Lond. B 64 747
23. Petch N J 1953 J. Iron Steel Inst. 174 25
24. Schiøtz J, Di Tolla F D and Jacobsen K W 1998 Nature 391 561