Fabrication of a micro-pin array with high density and high hardness by combining mechanical peck-drilling and reverse-EDM

Journal of Materials Processing Technology

Volumn 210, Issue 9, 2010, Pages 1103-1130

  Hwang, Yu Lung ^a   Kuo, Chia Lung ^a   Hwang, Shun Fa ^a  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Micro hole array; Micro pin array; Peck drilling; Precision platform; Reverse EDM; Vibration

Indexed keywords

AVERAGE DIAMETER; CHIP REMOVAL; CIRCULAR CROSS-SECTIONS; COMBINED METHOD; ELECTRICAL DISCHARGE MACHINING; HIGH DENSITY; HIGH HARDNESS; MICRO DRILLS; MICRO HOLES; MICRO-HOLE ARRAY; MULTI-STAGE; SINGLE STAGE; UNIFORM DIAMETER; WORK PIECES; WORKING FLUID;

ASPECT RATIO; DRILLS; ELECTRIC DIPOLE MOMENTS; ELECTRIC DISCHARGE MACHINING; ELECTRIC DISCHARGES; ELECTRODES; HARDNESS; MICROMACHINING; TUNGSTEN; TUNGSTEN CARBIDE;

VIBRATIONS (MECHANICAL);

EID: 77951254382     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2010.02.022     Document Type: Article

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