Micro-drilling of monocrystalline silicon using a cutting tool

Precision Engineering

Volumn 26, Issue 3, 2002, Pages 263-268

  Egashira, Kai ^a   Mizutani, Katsumi ^a  

^a KINKI UNIVERSITY   (Japan)

Author keywords

Ductile regime cutting; Micro drilling; Micro tool; Monocrystalline silicon

Indexed keywords

ASPECT RATIO; CUTTING TOOLS; DRILLING; DUCTILITY; ELECTRIC DISCHARGES; FRACTURE; GRINDING (MACHINING); SINGLE CRYSTALS;

ELECTRODISCHARGE MACHINING (EDM); MICRO-DRILLING;

SILICON;

EID: 0036641762     PISSN: 01416359     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0141-6359(01)00113-1     Document Type: Article

References (16)

1. Micro-ultrasonic machining by the application of workpiece vibration
2. Study on micro-EDM (3rd report): Fabrication of micro-mechanical elements
3. Study on fine boring of single crystalline silicon by EDM
4. Micro-structuring of silicon by electrodischarge machining (EDM). Part II. Applications
5. Lengths of crack extension and upper limits of depth of cut preventing crack extension in orthogonal cutting of ceramics: Their estimation using the stress field of the expansion of a cylindrical tube
6. Ductile-regime machining of germanium and silicon
7. Diamond turning of brittle materials for optical components
8. Ductile-regime machining model for diamond turning of brittle materials
9. Ductile-regime turning mechanism of single-crystal silicon
10. Diamond turning of silicon substrates in ductile-regime
11. Cutting of hard and brittle materials with a micro-tool
12. Micro-grooving and micro-threading tools for fabricating curvilinear features
13. Development of the micro-milling process for high aspect ratio micro-structures
14. Micro-structure grooves with a width of less than 50 μm cut with ground hard metal micro-end mills
15. Electro-discharge machine for micro-hole boring
16. Wire electro-discharge grinding for micro-machining