Synthesis and property measurements of polyimides with substituted pyromellitic dianhydride for flexible printed circuits applications

Journal of Applied Polymer Science

Volumn 117, Issue 2, 2010, Pages 736-741

  Choi, J K ^a   Yoon, T H ^a  

^a Gwangju Institute of Science and Technology (GIST)   (South Korea)

Author keywords

Adhesion; CTE; FPC; Polyimides; Synthesis

Indexed keywords

ADHESIVE PROPERTIES; BULKY SUBSTITUENTS; CTE; DIANHYDRIDES; FLEXIBLE PRINTED CIRCUIT; FOURIER TRANSFORM INFRARED; IMIDIZATION; INTRINSIC VISCOSITY; LOW COEFFICIENT OF THERMAL EXPANSIONS; O-DICHLOROBENZENE; PHENYLENEDIAMINES; PHENYLPHOSPHINE OXIDES; PROPERTY MEASUREMENT; PYROMELLITIC DIANHYDRIDE; T-PEEL TESTS; TWO-STEP PROCESS;

ADHESION; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONIC EQUIPMENT MANUFACTURE; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; ORGANIC POLYMERS; POLYIMIDES; PRINTED CIRCUITS; RESONANCE; SYNTHESIS (CHEMICAL); THERMOGRAVIMETRIC ANALYSIS;

THERMAL EXPANSION;

ELECTRICAL CIRCUIT; FLEXIBILITY; POLYIMIDE; SYNTHESIS; THERMAL EXPANSION; THERMOGRAVIMETRY; VISCOSITY;

EID: 77951241257     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.30211     Document Type: Article

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