Studies on development of electroless Ni-B bath for corrosion resistance and wear resistance applications

Surface Engineering

Volumn 26, Issue 3, 2010, Pages 153-158

  Srinivasan, K N ^a   Meenakshi, R ^b   Santhi, A ^b   Thangavelu, P R ^a   John, S ^a  

^a CENTRAL ELECTROCHEMICAL RESEARCH INSTITUTE   (India)

^b A V V M SRI PUSHPAM COLLEGE   (India)

Author keywords

Chemical deposition; Corrosion resistance; Electroless deposition; Nickel boron alloy deposition; Nickel boron phosphorous alloy deposition; Nickel methane sulphonate

Indexed keywords

ALLOY DEPOSITION; BORON ALLOYS; CHEMICAL DEPOSITION; ELECTROLESS DEPOSITION; SULPHONATES;

ABSORPTION SPECTROSCOPY; ALLOYS; ATOMIC SPECTROSCOPY; BORON; BORON COMPOUNDS; BORON DEPOSITS; COATINGS; CORROSION RESISTANCE; DEPOSITS; ELECTROLESS PLATING; FLUORESCENCE SPECTROSCOPY; HARDNESS; HEAT RESISTANCE; INDUSTRIAL APPLICATIONS; ION SOURCES; METAL CLADDING; METAL IONS; METHANE; NICKEL; NICKEL ALLOYS; NICKEL COATINGS; PHOSPHORUS; REDUCING AGENTS; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION;

WEAR RESISTANCE;

EID: 77951215502     PISSN: 02670844     EISSN: 17432944     Source Type: Journal    
DOI: 10.1179/174329409X409468     Document Type: Article

References (22)

1. K. Parker: Proc. 8th Interfinish Conf., Basel, Switzerland, September 1972, Birkhäuser Basel.
2. M. V. Ivanov: Prot Met (Translated from Zashchita Metallov), 2001, 37, (6), 592-596.
3. W. Riedel: 'Electroless nickel plating'; 1991, Metals Park, OH, ASM International and Finishing Publications.
4. G. G. Gawrilov: 'Chemical (electroless) nickel plating'; 1979, Surrey, Portcullis Press.
5. G. O. Mallory and J. B. Hadju (eds.): 'Electroless plating: fundamentals and applications'; 1991, Orlando, FL, AESF.
6. R. N. Duncan and T. L. Arney: Plat. Surf. Finish., 1984, 71, 49.
7. Y. L. Lo and B. J. Huang: Ind. Eng. Chem. Res., 1994, 33, 56.
8. H. Z. Zhang, X. J. Zhang and Y. K. Zhang: Plat. Surf. Finish., 1993, 80, 80.
9. Y. M. Chow, W. M. Lau and Z. S. Karim: Surf. Interf. Anal., 2001, 31, 321.
10. T. Osaka, N. Takano, T. Kurokawa, T. Kaneko and K. Ueno: Surf. Coat. Technol., 2003, 169-170, 124.
11. S. M. Ho, S. M. Lian, K. M. Chen, J. P. Pan, T. H. Wang and A. Hung: IEEE Trans. Compon. Packag. Manuf. Technol., Part A, 1996, 19, (2), 202.
12. M. Tsukimura, H. Inoue, H. Ezawa, M. Miyata and M. Ota: Mater. Trans., 2002, 43, (7), 1615.
13. K. M. Gorbunova, M. V. Ivanov and V. P. Moiseev: J. Electrochem. Soc., 1073, 120, 613.
14. T. S. N. Sankara Narayanan and S. K. Sheshadri: J. Alloys Compd, 2004, 365, (1-2), 197.
15. F. Delounois, J. P. Petitjean, P. Lienard and M. Jacob-Duliere: Surf. Coat. Technol., 2000, 124, (2-3), 201.
16. F. Delounois and P. Lienard: Surf. Coat. Technol., 2002, 160, (2-3), 239.
17. McComas: US patent 4,833,041, 1989.
18. J. Beilinski, J. Krol and A. Beilinska: Bull. Electrochem., 1990, 6- 10, 828.
19. I. Baskaran, R. Sakthi Kumar, T. S. N. Sankara Narayanan and A. Stephen: Surf. Coat. Technol., 2006, 200, 6888.
20. D. W. Baudrand: 'ASM handbook', Vol.5, 'Electroless nickel plating', 290; 1994, Materials Park, OH, ASM.
21. K. Krishnaveni, T. S. N. S. Narayanan abd S. K. Sheshadri: Surf. Coat. Technol., 2005, 190, 115.
22. A. Contreras, C. Leon, O. Jimenez, E. Sosa and R. Perez: Appl. Surf. Sci., 2006, 253, 592.