Condensation and cleaning of an organometallic copper compound to/from porous low-dielectric constant thin films in supercritical carbon dioxide

Physica Status Solidi (C) Current Topics in Solid State Physics

Volumn 5, Issue 5, 2008, Pages 1219-1222

  Kondoh, E ^a   Ukai, E ^a   Aruga, S ^a  

^a UNIVERSITY OF YAMANASHI   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION/DESORPTION; ELLIPSOMETRIC MEASUREMENTS; HIGH-PERFORMANCE INTEGRATED CIRCUITS; IN-SITU; IN-SITU ELLIPSOMETRY; KEY TECHNOLOGIES; LOW DIELECTRIC CONSTANTS; ORGANOMETALLIC COMPOUNDS; ORGANOSILICAS; SUPERCRITICAL CARBON DIOXIDES;

BUILDING MATERIALS; CARBON DIOXIDE; CARBON FILMS; COPPER; COPPER COMPOUNDS; EFFLUENT TREATMENT; ORGANOMETALLICS; SORPTION; SPECTROSCOPIC ELLIPSOMETRY; SUPERCRITICAL FLUIDS; THIN FILMS;

SUPERCRITICAL FLUID EXTRACTION;

EID: 77951140203     PISSN: 18626351     EISSN: 16101642     Source Type: Journal    
DOI: 10.1002/pssc.200777844     Document Type: Conference Paper

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