Deformation behavior of an ultrafine grained two phase Co-Cu alloy processed by electrodeposition

Scripta Materialia

Volumn 63, Issue 1, 2010, Pages 132-135

  Yuasa, Motohiro ^a   Kajikawa, Kota ^a   Nakazawa, Takumi ^a   Hakamada, Masataka ^b   Mabuchi, Mamoru ^a  

^a KYOTO UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Co Cu alloy; Electroplating; Mechanical properties; Ultrafine grained microstructure

Indexed keywords

[CO/CU]; ATOMIC SIMULATIONS; CO-CU ALLOY; CO-CU ALLOYS; DEFORMATION BEHAVIOR; DEFORMATION CHARACTERISTICS; FACE-CENTERED CUBIC; HEXAGONAL CLOSE-PACKED; HIGH STRAIN RATES; LOW ACTIVATION; ROOM TEMPERATURE; TWO PHASE; ULTRAFINE GRAINED MICROSTRUCTURES; ULTRAFINE-GRAINED;

ALLOYS; DEFORMATION; ELECTRODEPOSITION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MECHANICAL PROPERTIES; MICROSTRUCTURE; STRAIN RATE;

COPPER ALLOYS;

EID: 77951124870     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2010.03.035     Document Type: Article

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