Relationship between hardness and grain size in electrodeposited copper films

Materials Science and Engineering: A

Volumn 457, Issue 1-2, 2007, Pages 120-126

  Hakamada, Masataka ^a   Nakamoto, Yoshiaki ^a   Matsumoto, Hiroshi ^a   Iwasaki, Hajime ^b   Chen, Youqing ^a   Kusuda, Hiromu ^a   Mabuchi, Mamoru ^a  

^a KYOTO UNIVERSITY   (Japan)

^b High Process Research Ltd Co   (Japan)

Author keywords

Cu films; Electrodeposition; Hall Petch relationship; Hydrogen; Nanocrystalline Cu

Indexed keywords

COPPER; ELECTRODEPOSITION; GRAIN SIZE AND SHAPE; NANOCRYSTALLINE MATERIALS; VICKERS HARDNESS;

COPPER FILMS; HALL-PETCH RELATIONSHIP;

METALLIC FILMS;

COPPER; ELECTRODEPOSITION; GRAIN SIZE AND SHAPE; METALLIC FILMS; NANOCRYSTALLINE MATERIALS; VICKERS HARDNESS;

EID: 33947675900     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.12.101     Document Type: Article

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