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Volumn , Issue , 2007, Pages 54-57

Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CONCENTRATION (PROCESS); COPPER; COPPER ALLOYS; ELECTRONICS PACKAGING; MICROSYSTEMS; RATE CONSTANTS; SILVER; SOLDERING; SOLDERING ALLOYS; TECHNOLOGY; TIN; TIN ALLOYS; WELDING;

EID: 48649107274     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2007.4433566     Document Type: Conference Paper
Times cited : (6)

References (6)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.