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Volumn , Issue , 2007, Pages 54-57
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Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders
a
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Author keywords
[No Author keywords available]
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Indexed keywords
BRAZING;
CONCENTRATION (PROCESS);
COPPER;
COPPER ALLOYS;
ELECTRONICS PACKAGING;
MICROSYSTEMS;
RATE CONSTANTS;
SILVER;
SOLDERING;
SOLDERING ALLOYS;
TECHNOLOGY;
TIN;
TIN ALLOYS;
WELDING;
CONSUMPTION RATES;
CU CONCENTRATION;
DISSOLUTION RATE;
DRIVING FORCES;
ELECTRONIC PACKAGING;
INTERFACIAL REACTIONS;
METALLIZATIONS;
SN-AG-CU;
SN-AG-CU SOLDER;
SOLDER BALLS;
SOLDER VOLUME;
SURFACE FINISHING;
DISSOLUTION;
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EID: 48649107274
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IMPACT.2007.4433566 Document Type: Conference Paper |
Times cited : (6)
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References (6)
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