Properties of conductive microstructures containing nano sized silver particles

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 879-883

  Felba, Jan ^a   Nitsch, Karol ^a   Piasecki, Tomasz ^a   Tesarski, Sebastian ^a   Moscicki, Andrzej ^b   Kinart, Andrzej ^b   Bonfert, Detlef ^c   Bock, Karlheinz ^c  

^a WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

^b AMEPOX Microelectronics Ltd   (Poland)

^c Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BULK MATERIALS; CONDUCTIVE MICROSTRUCTURES; ELECTRICAL CONDUCTIVITY; ELECTRICAL PARAMETER; ELECTRICAL TESTS; MECHANICAL PARAMETERS; NANO SILVER; NANO-SIZED; POLYMER MATERIALS; PRINTED MATERIALS; PRINTED STRUCTURES; SILVER PARTICLES; SINTERING PROCESS; THERMAL PROCESS; TOTAL MASS;

ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; INK; SILVER; SINTERING;

INK JET PRINTING;

EID: 77950928877     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416421     Document Type: Conference Paper

References (11)

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