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6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings

Volumn , Issue , 2007, Pages 305-310

Conductivity improvement of microstructures made by nano-size-silver filled formulations

(4) Mościcki, Andrzej a Felba, Jan b Gwiaździński, Przemysław a Puchalski, Michał c

a AMEPOX Microelectronics Ltd (Poland)

b WROCLAW UNIVERSITY OF TECHNOLOGY (Poland)

c UNIVERSITY OF LODZ (Poland)

Author keywords

Conductive microstructures; Ink jet printing; Microelectronics; Nano size silver

Indexed keywords

ADHESIVES; ELECTRONICS INDUSTRY; INK; MICROELECTRONICS; PHOTONICS; POLYMERS; SILVER;

CONDUCTIVE MICROSTRUCTURES; CONDUCTIVITY IMPROVEMENT; CURRENT TRENDS; ELECTRONIC DEVICES; HIGH ACCELERATION; INK-JET METHODS; INK-JET PRINTING; INK-JET TECHNOLOGY; MICROELECTRONIC INDUSTRY; MILITARY FIELDS; NANO SIZES; NANO-SIZE-SILVER; NEW MATERIALS; NEW TECHNOLOGIES; PRODUCTION EQUIPMENTS; PRODUCTION METHODS; WIDE SELECTION;

TECHNOLOGY;

EID: 49949094753 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/POLYTR.2007.4339189 Document Type: Conference Paper

Times cited : (21)

References (6)

1
- 49949096255
- Creagh L.T., Digitally Printing Electronics with Piezo Ink Jet, IMPAS 2004, Long Beach, USA.
- Creagh L.T., "Digitally Printing Electronics with Piezo Ink Jet", IMPAS 2004, Long Beach, USA.

2
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- Jet Dispense for Electronic and Optoelectronic Packaging
- Prague, Czach Republic
- Quinones H., Babiarz A., Fang L., Fiske E., "Jet Dispense for Electronic and Optoelectronic Packaging", European Microelectronics and Packaging Symposium, Prague, Czach Republic, 2004, pp. 348-290.
- (2004) European Microelectronics and Packaging Symposium , pp. 348-290
- Quinones, H.¹ Babiarz, A.² Fang, L.³ Fiske, E.⁴

3
- 0036564905
- Physical Characteristics of Stabilized Silver Nanoparticles Fordem Rusing a New Thermal-Decomposition Method
- Nagasawa H. Maruyama M. Komatsu T. Soda S. Kobayashi T., "Physical Characteristics of Stabilized Silver Nanoparticles Fordem Rusing a New Thermal-Decomposition Method", Phys.Stat. Sol. 191, 2002, No. 1 p. 67-76
- (2002) Phys.Stat. Sol , vol.191 , Issue.1 , pp. 67-76
- Nagasawa, H.¹ Maruyama, M.² Komatsu, T.³ Soda, S.⁴ Kobayashi, T.⁵

4
- 33847232915
- Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology
- Wrocław, Poland
- th International Conference of Polymers and Adhesives In Microelectronics and Photonics, Wrocław, Poland, 2005, pp.40-44.
- (2005) th International Conference of Polymers and Adhesives In Microelectronics and Photonics , pp. 40-44
- Mościcki, A.¹ Felba, J.² Sobieraj ski, T.³ Kudzia, J.⁴ Arp, A.⁵ Meyer, W.⁶

5
- 42549104961
- Mościcki A., Felba J. Dudziński W., Conductive Microstructures and Connections for Microelectronics Made by Ink-Jet Technology, 1st Electronics Systemintegration Technology Conference, Dresden 2006, p.511-517
- Mościcki A., Felba J. Dudziński W., Conductive Microstructures and Connections for Microelectronics Made by Ink-Jet Technology, 1st Electronics Systemintegration Technology Conference, Dresden 2006, p.511-517

6
- 49949102790
- IEC 60068-2-58:2004 standard
- IEC 60068-2-58:2004 standard

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.